Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano
Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and
Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy
We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new
Electronics Forum | Tue May 09 14:56:43 EDT 2006 | JW
An option to consider is leave top and bottom heaters settings the same; to get correct liquidus time and temperature on one side, you will have some amount of reflow on the second side. If you have BGA's, QFP's on the bottom side yet they are smalle
Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
Electronics Forum | Tue Feb 10 02:14:39 EST 2009 | emmanueldavid
Smartasp, Seems this issue is certainly making a long thread ! As far as our Experience is concerned on Reflow Soldering, particular parts must have failed in LSLs [Lower Specification Limit] and have not withstand well under USLs [Upper Specificat
Electronics Forum | Fri Mar 01 03:16:01 EST 2013 | grahamcooper22
Solder paste flux formulation can make a difference when soldering to nickel silver...due to the alloy containing metals that oxidise easily like zinc and nickel then the flux has to be able to cope with the surface oxidation when the parts are in th
Electronics Forum | Mon Sep 30 04:27:40 EDT 2013 | grahamcooper22
I am not sure what the IPC spec is suggesting....K type thermocouples are normally specified upto 1250 C, of course there is a tolerance in their accuracy and this probably degrades after hundreds of uses through a reflow oven, but normally the accur
Electronics Forum | Thu Dec 08 01:44:44 EST 2016 | cmarasigan
We are currently experiencing with our SMD Solder Reflow Equipment on Shooting-Up Zones (Zones 3,4,5,7 & even Cooling Zone). PV exceeds about 5-10 degrees with the SP. (ex: SP=140deg, actual PV = 145deg & higher). Our equipment undergo a monthly prev
Electronics Forum | Sun Mar 19 00:38:54 EDT 2017 | jlawson
1. Rehm Thermal Systems (Germany) 2. BTU (USA) ,Ersa (Germany) , SMT (germany) 3. Vitronics (USA) , Speedline (USA),Tamara (Japan) 4. Heller (USA), JT(China) This is how I would rate the main brand reflow's others may disagree. They all reflow , b
Electronics Forum | Mon Mar 16 18:15:32 EST 1998 | ETS, LLC
Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago that deals with this exact subject. Best way to deal with this is to use a center
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