Electronics Forum | Thu Aug 26 04:22:26 EDT 1999 | JAX
| | | | | | | Hello everyone, | | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Than
Electronics Forum | Fri Jun 25 03:16:38 EDT 1999 | Scott Davies
Wayne, Earl, I wish there was some way we could toss our wave solder machine forever! Unfortunately, we haven't found a way yet to do paste-in-hole reflow for large numbers of thru-hole axial and radial components, which we insert on Universal machi
Electronics Forum | Tue Jun 08 10:01:34 EDT 1999 | John Thorup
| Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. | | I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely
Electronics Forum | Fri May 28 07:37:52 EDT 1999 | Steve Cheung
Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect 144 p
Electronics Forum | Tue Mar 23 10:22:17 EST 1999 | Chrys Shea
| Are there many of you who are soldering through hole parts in your surface mount reflow oven? How repeatable is the process? Do you need to touch up a lot after reflow? We don't do long runs maybe 200, 300 boards max. Can you just screen print
Electronics Forum | Thu Aug 06 12:16:52 EDT 1998 | Rin
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
Electronics Forum | Wed Jan 30 08:30:33 EST 2002 | seto
Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder joint is very strong). The problem is associated with poor contact after the use by the customer (vibration, temperature, etc). You can see the pictures
Electronics Forum | Mon Apr 22 23:51:06 EDT 2002 | mkkrishnakumar
Dear sir, I am a regular viewer of smtnet.com and now one of my customer have the process problem that is they are having double sided smd's and pth too. hence we have suggested them to do the following processes First do the smd soldering by ste
Electronics Forum | Wed Jun 26 21:41:46 EDT 2002 | ianchan
Hi mate, "no more than 6hrs in the stencil" for us means: 1) we finish setup of reflow oven, P&P m/c, and lastly the printing machine(includes loading of stencil into printer machine). 2) once printer machine is setup, we rip-open the paste Can pr
Electronics Forum | Wed Aug 14 16:44:54 EDT 2002 | dragonslayr
What is the surface finish? HASL, Entek? what? If HASL, ask your fab supplier for recommendations, maybe even rerun the boards through the HASL process. The fab house would have to strip off the old coating and reapply. Just a thought, depends on y
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