Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef
His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could
Electronics Forum | Tue Feb 27 11:25:39 EST 2001 | slthomas
Simply trying to answer a management question: "Can we do bottom side w/o capital expenditures?" If we reflow top and bottom we eliminate the need for dispensing and another oven. Do more with nothing, sort of. Of course the cost in loss of through
Electronics Forum | Fri Jul 24 16:03:56 EDT 1998 | Boris Akselrud
Dave, Thanks for your responce. I think I can manage to solder components by hand. But I am trying to find out an alternative way to solder them. The distance between leads becomes very small and if solder gets in between them I will have hard times
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX
Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the
Electronics Forum | Tue Dec 28 15:35:21 EST 1999 | Mike Naddra
Edmund, An 0603 component should not fall from the board durring an inverted reflow pass, provided that: Your land geometries are correct for the package type (Start with SM 782 guidlines)- as surface tension of the liquidous solder is what holds
Electronics Forum | Tue Dec 11 18:32:30 EST 2001 | edmentzer
Does anyone have experience with different colors of solder mask. I am interested to know if a clear or light color mask is better in the reflow process. Most of the boards we do have a green solder mask. It seems to me that I read somewhere that
Electronics Forum | Fri Apr 12 16:30:21 EDT 2002 | stepheno
If you are going to wavesolder the board after SMT you will have to epoxy the parts on instead of paste/reflow. I used to work for a company that squeeged it on. You will have to research component layout guidelines if you do want to wavesolder. If
Electronics Forum | Fri Dec 16 11:04:23 EST 2005 | chunks
Over all time will be dictated by your conveyor speed. Your conveyor speed will be dictated by your products time above liquidous. Time above liquidous is dictated by the manufacturers specification. Time and temp before reflow will have to be ach
Electronics Forum | Fri Jan 30 04:10:10 EST 2009 | sachu_70
Hey Daniel, N2 gas provides an inert atmosphere which help to minimise oxidation, generally a concern across the reflow zone. Although N2 provides a more shiny solder joint, it is certainly more of a cosmetic issue and does not certify joint reliabil
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