Electronics Forum | Wed Aug 22 16:41:09 EDT 2018 | emeto
To all good suggestions I will add a few other thoughts: 1. Check PCB design(attached). THis mask clearance there is designed so you have some gas escape plan- verify if your PCB design follows that. 2. You can have a long soak reflow profile to re
Electronics Forum | Wed Mar 13 15:05:09 EDT 2019 | SMTA-Joe
Hello SMTA, We are looking to evolve our manufacturing processes by acquiring a Pick & Place machine. This is a technology we are currently not familiar with, and are looking for a thorough training course to attend. Can anyone recommend a trainin
Electronics Forum | Mon Jul 15 18:11:36 EDT 2019 | slthomas
First question - is your company already compliant with and/or certified to AS9001? If not, is your company compliant with and/or certified to ISO 9001:2015? There are several overlapping requirements. If the answer is no to the previous and you pla
Electronics Forum | Tue Jul 18 00:15:37 EDT 2023 | hazira1991
Is a fresh lot. This bga is old date code 2010. we had received this BGA 2021 and the baking process is done during receiving time. Production received with vacuum seal , its very hard to tell how the BGA handling and stuff and the BGA already EOL. I
Electronics Forum | Mon Jun 04 16:27:55 EDT 2012 | jorge_quijano
Hello there, I just want to ask you how often do you take your profiles on the Reflow Oven and Wave solder? I have a HMLV line running 5-6 products per shift (Reflow Oven & WS) my tech spend too much time checking the profile, but no major difference
Electronics Forum | Thu Sep 03 14:09:22 EDT 1998 | Matthew Park
Rich, From my experience, few causes of capacitor cracking are: - mechanical stress caused by pick'n place nozzles and chucks. Try to isolate and find cracked caps before boards go thru reflow or wavsoldering. - thermal stress by reflow pro
Electronics Forum | Wed Jun 26 00:49:52 EDT 2002 | ianchan
Steve, I'd second Daan's opinion. BGA profile we use gets a peak of 210deg-C to 223deg-C (but that's using our WS paste unique characteristics) with reflow zone holding time of 45-60sec. We had 6 PBGA and 2 ceramic BGA on a 6 layer PCB. typical p
Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Fri Apr 23 16:19:17 EDT 1999 | Todd
We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using a
Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm
Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s
