Electronics Forum | Mon Dec 09 09:54:16 EST 2002 | davef
Large copper pours create an unbalanced lay-up that is bad design practice, creating problems in fabrication and assembly. The hatching a previous poster mentioned could be an alternative. Stepping back a bit and wondering, what's the problem? You
Electronics Forum | Sun Aug 29 19:17:34 EDT 2004 | aqueous
Chen, It is always best to place one�s effort on determining the cause and content of the residue rather than trying to work around it. The first thing you must determine is the nature of the residue. Is it flux? In many instances, the residue is
Electronics Forum | Sun Sep 28 17:14:53 EDT 2008 | ronsou
small pads like 0402 tend to get hot quite > easily. looks like excessive heat is your problem > here. pads are wetted, component leads are not. > this means solder paste flux on top layer was > exhausted before entering in reflow. your profile
Electronics Forum | Fri Oct 02 10:34:20 EDT 2015 | dyoungquist
After looking at your profile, some general thoughts.... Your profile looks like what is commonly called a ramp-spike profile and not a ramp-soak-spike profile. Going off of Sarason's comment, you may not have a good soak period before the spike in
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Thu Jun 13 19:58:51 EDT 2002 | john_wsme
Dear All, We have a SRT BGA rework machine and we created several profiles following solder reflow reqirement, but when we installed BGAs, we saw a lot of solder bridging in the conner. Please give us some ideas to eleminate this problem. Thanks in
Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya
I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.
Electronics Forum | Thu Feb 14 07:33:24 EST 2008 | cyber_wolf
Does anyone have any experience with this component ? We seem to have some warping issues through reflow. We have tried everything profile wise....pre bake parts etc.
Electronics Forum | Fri Jan 17 02:29:59 EST 2020 | soupy
Thanks Dave, We have avoided rotating the board as it is so long but we will test. Maybe we will to try screen it in one direction and then rotate it before the oven. We have the maximum solder we can get there at the moment. The reflow engineer
