Electronics Forum | Fri Sep 07 12:19:20 EDT 2007 | guqing
We are having problem to develop lead-free (SAC305) reflow profile for big SMT electrolytic caps. The delta T of the joint of the cap with the rest of the board is too big to fit in the tighter lead-free window. Any suggestions regarding the total pr
Electronics Forum | Thu Apr 11 11:26:34 EDT 2002 | johnw
Dave, I sand corrected since I know you wouldn't steer me wrong...although the lst time I looked at the IPC spec for a solder profiel it was still designed for older generations of paste and were specifically water wash biased although that doesn't c
Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Thu Mar 24 12:33:01 EST 2005 | Dreamsniper
I used KIC before now I'm using MOLE. I recommend KIC. regards,
Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj
Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo
Electronics Forum | Mon Jul 12 13:24:38 EDT 2010 | tate350
Like robdg3 said, just check your paste spec and define your reflow profile accordingly. There should not be any major difference in reflow profile due to PCB finish.
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef
Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of
Electronics Forum | Tue Mar 22 06:08:45 EST 2005 | Grant
Hi, We used to manually profile by comparing logged temp numbers and matching the paste profile. But we got a KIC and it's software was so much better we got a good reduction in rework and we have almost no first run faults now. I would recommend on
Electronics Forum | Fri Jun 06 04:52:21 EDT 2003 | kevyeoh
Hi all, I am just wondering is there any other Lead Free Standard Profile for IR reflow besides the standard provided by Jedec ? What if the profile that i use is different from the one provided by jedec ? Lets say the peak temperature for Jedec is