Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Wed Feb 21 20:40:44 EST 2001 | jagman
I appreciate both of your responses. I spoke with a tech rep at a distributor of the Loctite 3609 and asked him if this adhesive can be cured using a bake oven (Blue M, Despatch, etc.), rather than convection/IR. He stated that he's never heard of
Electronics Forum | Fri Jul 24 12:02:06 EDT 1998 | Steve Gregory
Stoney, One thing you might do before you start dispensing epoxy, (...I know this might be a bit of a pain) is to run your boards on the mesh belt instead of the edge-rail conveyer. I used to have to do that with some very,very dense double sided mem
Electronics Forum | Sat Feb 14 08:30:08 EST 2009 | smartasp
Thank you all for your valuable inputs. Have having done some more investigation we have realized that there is actually no standard as such to which the ROHS components have to be manufactured aside from the contains of substances like PB and al o
Electronics Forum | Wed Dec 22 14:21:13 EST 2004 | James Dornan of APE Inc
A little late but if this subject is still of interest the following paper from APE may be of interestwhen considering IR to Air Bath: HOT AIR versus IR and other convection Rework Systems HOT AIR is the most popularly chosen method of rework in th
Electronics Forum | Thu Jun 19 10:36:54 EDT 2003 | Jacob
Hi all I am having a reflow problem. Recently we started using a through hole connector with solder flux bearing technology on a densly populated board. The connector reflows at the same time as the smt components through reflow. The problem I am ha
Electronics Forum | Fri Jul 09 09:01:18 EDT 1999 | Marc P
| | Hi! | | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board unif
Electronics Forum | Mon May 04 12:07:58 EDT 1998 | ETS, LLC
As an employee of a Reflow Oven Manufacturer I can only make suggestions on the oven portion of your process: As I was reading through your posting I started wondering if you are using a convection or IR based oven. If you are using Convection I woul
Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw
The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint