Electronics Forum | Thu Jun 25 20:16:01 EDT 1998 | chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Fri Mar 19 12:09:17 EST 2004 | Primus
I'm just getting more involved with SMT, as I've been a through-hole operator for years. But I don't understand how one could reflow SMT components AFTER the through-hole insertion and solder wave are finished. How does one print paste over a board w
Electronics Forum | Fri Jun 09 12:35:00 EDT 2006 | G. eisner
We are finding this diode not reflowing well. We are having tombstoning issues with this part and only this part on different pcbs. The main thing we find is that under a scope there is blow outs as in air bubbles that look like they have exploded. I
Electronics Forum | Wed Feb 17 12:16:17 EST 2010 | dcell_1t
Hi there: During the past weeks (let's say since beginning of the year) we've been experiencing some issues with shifted components. We verify for position before Reflow oven and the components are Ok, but they observe shifted after reflow. it occurs
Electronics Forum | Wed Oct 11 21:55:27 EDT 2017 | action_101
I've used plenty of weights in the wave solder process, but not in the SMT reflow process. Ask yourself some why's.... such as why is the part lifting at one end? (board bowing possibly), why? Not the correct tg material or issue with oven profile? W
Electronics Forum | Fri Sep 09 21:09:20 EDT 2011 | hegemon
Wow, a lot of questions here...and you are definitely doing some "tough sledding". To the point. If you have 3 - 22" zones you'll have to calc your belt speed and temperatures to match the solder paste requirements with regard to flux activation an
Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem
Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia
Electronics Forum | Wed Oct 03 17:07:52 EDT 2001 | davef
We have had soldering problems with fine pitch QFP in the past [and probably will in the future]. Several questions leap to mind: * When you took your profile on the component pads, do you profile on the pads that did not solder well? * When you say
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
