Electronics Forum | Fri Jun 15 09:16:46 EDT 2001 | adam
Thanks Dave. About your second comment, the issue is placing BGA connectors mirror image (male, and female), the connector sometimes shifts during placement before reflow. we are using a six mil stencil for both sides with minimum paste deposit. a
Electronics Forum | Mon Jun 25 01:57:07 EDT 2001 | nifhail
We experienced a random no contact at ATE on our board. The board I'm building consist of 9 BGAs, all of them are OK except for one, intermittently the tester will prompt no-contact message. It's happened on a diff. I/O, but only happened on that pa
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Fri Dec 17 06:11:33 EST 1999 | Christopher Lampron
Henry, TNT makes some good points. I have also found that the use of a 2% silver solder paste (provided that it's allowable) can help reduce the occurance. You may want to run a thermal profile on the PCB is question. Is the board thermaly equalized
Electronics Forum | Tue Nov 02 11:44:54 EST 1999 | Wolfgang Busko
Hi Pat, is the soldering Ok when you solder them by hand ? We use some larger ferrite beads with no problems in reflow but I must say that we use a vapour phase and only max 5 parts/PCB. They do have a high thermal capacity and you use a lot of them,
Electronics Forum | Thu Oct 28 17:46:44 EDT 1999 | Gary Kemp
My company manufactures memory modules and I'm finding solder specs on the gold fingers following the reflow process. We are using a no-clean solder paste. The spec sheet warns against crossing the 140 degree C mark during the soak stage, preventin
Electronics Forum | Tue Jun 01 08:30:51 EDT 1999 | Dave F
| I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave soldering
Electronics Forum | Thu Jun 03 18:53:27 EDT 1999 | Raeto Zryd
| | I have difficulty to convince my management to air-condition our manufacturing facilities. The room temperature fluxuates from 8 deg.C in the morning to 25 deg. C in the afternoon. The PCB topside temperatures in the reflow oven and wave solderin
Electronics Forum | Fri May 21 10:16:31 EDT 1999 | Parvez
Dave, i tried reflowing bare boards with only solder printed on em and no component placed. we still got voids as same as when components were placed. so atleast one of that theories(voids due to component/component placement)could be considered to b
Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle
I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything
