Electronics Forum: reflow profile (Page 71 of 259)

BGA 1517 XLINX REFLOW PROFILE

Electronics Forum | Thu May 26 10:47:28 EDT 2005 | james

What is the highest temperature set at in your oven and your belt speed. Also what type of oven do you have? Thanks much. Your right about alot of heat needed. We actually see the outside balls much flatter and soldered compared to the middle bal

BGA 1517 XLINX REFLOW PROFILE

Electronics Forum | Thu May 26 21:07:22 EDT 2005 | KEN

This is caused by cte mis-match. The balls in the corners are short and fat. The balls near the null point are tall and more normalized. I don't remember what the zone settings were... BTU VIP98 BS was probably 22-25 IPM

Soler Paste Flux %

Electronics Forum | Thu Jun 09 09:10:56 EDT 2005 | russ

I think I would work on the reflow profile or your paste handling procedures to prevent the splattering. I might even change paste suppliers or formulations.

Solder Paste Voids

Electronics Forum | Wed Nov 23 15:02:38 EST 2005 | tglenn

We are using AIM WS300 solder paste and are experiencing excessive voiding on our BGAs. We have exhausted reflow profile alternatives and just can't beat the voids. Has anyone had success with this paste on BGAs? If so how?

SMT COMPONENTS TESTING

Electronics Forum | Mon Jan 09 16:47:45 EST 2006 | slthomas

Perhaps I read your question wrong, but I would be more inclined to look for changes in your solder paste, your screen printing process, and your reflow profiles if you're suddenly having problems with more than one component.

Chip capasitor plating

Electronics Forum | Mon Jan 09 08:47:27 EST 2006 | azbvc

Hi guys.. I just want to know on what are common types of terminal plating on chip capasitor and does each plating will affect reflow profile? Thank..

Component Peel Strenght

Electronics Forum | Tue Oct 10 13:32:26 EDT 2006 | rsteele

Does anyone know of any tests or testing done on the peel strength of components to pads. I have alot of info on FAB level peel strength testing, but nothing on components themselves. Is there any process(es) to test and insure new pastes and reflo

Reflow Profile Design

Electronics Forum | Mon Jun 18 14:46:24 EDT 2007 | ck_the_flip

I have heard that with lead free soldering, the cooldown phase is NOT as critical as it is for Tin-Lead. -2�C per second cooldown is good enough to form a good solder joint with good grain structure.

Temperature Probes for Reflow Profiling

Electronics Forum | Wed Jul 11 13:34:57 EDT 2007 | pauld

Thanks Pete, I have plenty of Omega thermocouple leads on hand. By the way ECD is the mfg asking $989 for a probe that costs about $100, to which they add a pcb edge clamp.

Temperature Probes for Reflow Profiling

Electronics Forum | Mon Jul 16 01:15:06 EDT 2007 | d0min0

Samir, can You share Your mod for slimKIC ? :) I have one set free and wanted to buy surfer kit - but I could also try to make my own carrier if I know key points HOWTO :)


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