Electronics Forum | Fri Sep 04 15:33:09 EDT 2009 | martinphill
Is it possible to Process Top & Bottom side PCBA simultaneously in One SMT Line. (An atrticle by Jagadeesh Rajagopalan, SMT Process consultant). Pls check this and suggest me whether it is possible? & What should be the Lead free Reflow Profile? ht
Electronics Forum | Sat Sep 05 23:15:32 EDT 2009 | prasadz
We have successfully implemented this dual Process You can use any printer that supports Board width 500mm. SMT Dual Process Maximum PCB Width should be (500-20 / 2 ) = 240mm Max (PCB width )Printer support = 500mm Top width + Bottom width
Electronics Forum | Thu Oct 01 06:22:48 EDT 2009 | rajeshwara
We approved the Reflow Profile from Cookson Solder Paste Manufacturer we are using. Now I am suspecting on method of vias designing below that QFP.There is exposed pad for that QFP and we print solder paste there , but when i see under x-ray there is
Electronics Forum | Tue Jul 06 08:28:16 EDT 2010 | Sean
Hi all, Recently, we found the IC lead dewetting as shown in the attached file..This problem only happen on particular lead only...We checked our reflow profile and its look everything is fine..We did cross section and EDX..I think this could be mat
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
Electronics Forum | Wed Feb 23 01:06:06 EST 2011 | kemasta
Hi all Recentlt I encounter a issue, the solder paste was not dry after wave. Mostly happen and the end of the board. It is rare case, 1 day happen about twice. But to achieve our quality target, I still need to overcome this issue. I use Alpha OM-
Electronics Forum | Thu Jun 28 09:57:50 EDT 2012 | mosborne1
blow holes and via holes are almost always caused by moisture and in PTH they could be moisture and improper drilled holes. If you are seeing solder balls next to the parts than I would say you have a reflow profile problem. Are you using any kind of
Electronics Forum | Thu Oct 25 14:15:18 EDT 2012 | kkay
Yes it looks like I attached the wrong reflow profile and I'll get the new one in there. Our TAL should be between 60-90 sec over 217. I'm not sure the embrittlement would be an issue as we have seen this issue across at least 3 different board vendo
Electronics Forum | Sat Feb 02 07:07:47 EST 2013 | bandjwet
The keys to avoiding the voids we have found are: 1. Proper reflow profile 2. Proper stencil design 3. Prebumping using either a metal stencil or StencilMate stencils (and then using paste flux to attach later) http://www.solder.net/products/stencilm
Electronics Forum | Sat Nov 23 08:05:20 EST 2013 | emeto
Hi, I would check the thing in the following order. 1. Check paste - SPI is the best way. If you don't get the right deposit there is no wonder you have issues. 2. Check reflow profile - tweak it to the point of perfection for the board you have. 3