Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
Electronics Forum | Tue Sep 14 13:54:13 EDT 2004 | paul_boxboro
I'm with Chris' approach as a first effort. If you don't have any luck, consider using a high (reflow)temp solder paste for the first pass reflow, and your standard solder paste for the second pass refow. Years ago I had a similiar challenge with an
Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
Electronics Forum | Wed Jan 05 18:31:30 EST 2005 | russ
It is possible to re reflow (is that right?) these assemblies. You will probably have to mask off or remove the through hole components if they cannot withstand the reflow temp. I would recommend however, that you utilize a hot air process to ins
Electronics Forum | Thu Feb 10 09:25:44 EST 2005 | lyrtech
Hi, Actually we're looking for a new reflow oven regarding lead-free process and higher capacity production. We have an opportunity for a second hand Electrovert Omniflo-7 (nitrous ready) that respect our budget. My questions are: Does anyone ha
Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf
I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t
Electronics Forum | Wed Sep 21 20:03:34 EDT 2005 | kevinbooth
I am going to agree with Rob a little. It is also possible that a internal ground plane might be under or connected to the pads of this cap thus causing a increase in temp to this part during reflow. This can cause parts on occasion to jump from the
Electronics Forum | Thu Dec 01 14:24:25 EST 2005 | Amol Kane
Hi, I am having a SAC 305 solder paste with water soluble flux wetting issue. during reflow, the solder melts, but doesnt flow. the reflow profile was developed by the solder company person (Kester). the board is a test assembly to validate our LF pr
Electronics Forum | Fri Dec 16 11:04:23 EST 2005 | chunks
Over all time will be dictated by your conveyor speed. Your conveyor speed will be dictated by your products time above liquidous. Time above liquidous is dictated by the manufacturers specification. Time and temp before reflow will have to be ach
Electronics Forum | Mon Jan 23 03:17:10 EST 2006 | pavel_murtishev
Good morning, IR reflow is yesterday technology. IR heating principle has a lot of issues with heat transfer capability (shadow effect) and uneven PCB heating. To avoid this forced convection ovens were developed. Reflow oven for SMD soldering must
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