Electronics Forum | Wed May 17 20:37:08 EDT 2000 | Steve
At our facility, we process FR-4 boards for PCMCIA cards (0.020"). The key for us is dedicated fixturing for stencil printing and fixturing for reflow soldering. We are working closely with our customer to better improve panel design, but other than
Electronics Forum | Fri May 12 20:15:49 EDT 2000 | M Cox
There are a variety of options without knowing what kind of components are on the bottom side (C's and R's 0805 or 0603 or 0402) you are talking about consider the following Option 1 If bottom side has only Caps, resistors and/or Soic's then... Top s
Electronics Forum | Wed Apr 26 22:34:49 EDT 2000 | Eric Chua
1. Verify all the part had load to machine. Get ready for the profile. 2. Run the board with double side tape. Is better to run one board for each machine. 3. Verify all the placement ( missing, misalgnment,etc )and check the value using meter for a
Electronics Forum | Tue Apr 11 09:45:45 EDT 2000 | emmanuel
Hi Kc, As recommended by the PBGA supplier, the temperature of the package surface should not exceed 225�C during 10 seconds max so as to avoid popcorn effect. Given that some of products reflow profils are specifiing reflow temperature at 250�C,
Electronics Forum | Wed Feb 23 14:44:28 EST 2000 | Travis Slaughter
Your solder paste manufacturer should determine the time. As far as temperatures those will very with each board. Creating a profile comes down to trial and error, there are some nice tools that help, the MOLE profiler is one, but there are just wa
Electronics Forum | Tue Feb 22 05:50:40 EST 2000 | Arulvanan P
Hi, I am in the process of implemeting Through Hole Reflow. 1.I would to know which are the products/Companies that use that use this process. 2. Is there any reference / standard to convince my QA dept. to accept the boards even though there is no
Electronics Forum | Wed Feb 23 20:29:43 EST 2000 | Rex B
ECD is working on some tools in the area of determining the Ideal or most Robust Profile, for a given paste, oven configuration and conveyor speed. Translation of this "most robust profile" into actual oven setting requires more knowledge about the
Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Thu Feb 15 07:04:59 EST 2001 | CRAIGS
Antonio, one possibility I have seen before on BGA shorts was due to chain slippage on the reflow oven due to worn gearing, the slippage was not severe enough to move other SMT devices but was enough to disturb the molten solder under the BGA
Electronics Forum | Tue Feb 20 16:51:22 EST 2001 | davef
You should evaluate products from Datapaq, Electronic Controls Design, and Kic Thermal Profiling. Each sells very good reflow profiling equipment. Beyond the straight forward issues surrounding the question of "Does this thing produce a good profi
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
