Electronics Forum | Thu Oct 01 06:44:44 EDT 1998 | PARK KYUNG SAM
Are there anyone who can give me the answer about solder ball problem? We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. So when w
Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
Electronics Forum | Thu Sep 03 12:42:50 EDT 1998 | Mike Cox
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Wed Aug 12 07:31:37 EDT 1998 | Earl Moon
| We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are ther
Electronics Forum | Thu Jul 30 11:00:19 EDT 1998 | Matt Harding
I have some potential unused SMT equipment which may be candidates for sale. Any input regarding the value or expected going rate would be appreciated. CONDITION: E - Excellent Condition F - Fair Condition G - Good Condition Equipment List: BRAND
Electronics Forum | Wed Jul 29 04:03:15 EDT 1998 | Bob Willis
The Reflow Soldering Interactive Test was well received in the industry with over 200 engineers testing their process knowledge. Now its time to take the Wave Soldering challenge and test you knowledge on soldering through hole and surface mount. Bot
Electronics Forum | Sat Jul 25 01:25:31 EDT 1998 | Chiakl
Hi, I am currently facing alignment problem on TBGA. Before reflow, the alignment is good. After reflow, Most of the TBGA was off the pad by 25% or more. The peak temperature on TBGA is 210 C with liquidus time that about 50 sec. Paste thickness is 7
Electronics Forum | Tue Jul 21 09:53:13 EDT 1998 | Steve Brown
Here at M/A-Com we use lead free solder pastes for two purposes, environment and prevention of secondary reflow in subsequent processes. The UK engineering journals all report the trends towards lead free alloys, especially in the telecommunications
Electronics Forum | Wed Jul 08 20:57:11 EDT 1998 | hyeon-jin Kim
I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. After reflow soldering, we have often "blister phenomenon". Our reflow profile is normal. Factory conditio
Electronics Forum | Wed Jul 01 11:33:30 EDT 1998 | Upinder Singh
Hi all. I am trying to put one 20 pin thru hole connector along with the smt components on the PCB. I would appreciate if somebody can guide me in getting thru this process. I also need to know how much bigger the holes on the screen or stencil shou
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
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