Electronics Forum | Mon Aug 25 08:26:33 EDT 2008 | scottp
We've gone through this a couple times. Once it was because the device was warping in reflow. We confirmed with shadow moire that the corners were lifting up. The supplier fixed some things in their molding process to reduce the warpage. Another
Electronics Forum | Tue Oct 07 03:03:06 EDT 2008 | rafacadiz
We had the same problem last year. You need verify these key points. 1- Holes are drill, NOT PUNCH. 2- Inspect 100 Boards at microscope, and verify that there is not rest of fibers in the holes. 3- Meassure the dimensions of the holes. a) virgi
Electronics Forum | Sat Oct 18 20:35:25 EDT 2008 | arosario
I see, maybe changing my peak temp in reflow will help. I'll try do eval again... Actually, once I did have evaluated a longer pre-heat but on my previous eval, I didn't change the peak temp. Maybe reflow can help compensate to my problem in the part
Electronics Forum | Fri Nov 14 17:21:17 EST 2008 | cisridn
Plugging the holes with temporary solder mask helped some, but once the solder starts to reflow, the fumes from the flux pushed the solder mask out. What I ended up doing in addition to using the temporary solder mask was covering the areas of pcb w
Electronics Forum | Tue Dec 16 16:49:22 EST 2008 | scottd3
We ran into this problem before, on all of our models. We never quite found out the reason, we do know that if the PCB is passed through a reflow oven that is extremely dirty with evaporated solder paste flux, it will make it extremely difficult (or
Electronics Forum | Wed Apr 08 07:16:21 EDT 2009 | arrowvale
We have just switched to Almit (www.almit.com)LFM48 W TM-HP-S lead free solder paste. In general terms it is an easy printing paste, with great slump properties, wide reflow process window and offers excellent solderability on all pcb / component pa
Electronics Forum | Tue May 12 16:04:24 EDT 2009 | microdot
hi, we have recently got a PS-400 BGA reflow from china. has hot air top heater, IR & hotair bottom heater and 6 IR bottom heaters. We are able to handle all type of desktop boards but in few of the laptop boards we still have problem. The profiles
Electronics Forum | Thu May 14 13:25:14 EDT 2009 | cyber_wolf
Me thinks generic profile + desktop and laptop computer boards= not happy time. Attach thermo-couple to appropriate location on said part/pcb. Make profile same as solder manufacturer / component manufacturer spec. There is no magic heater set poin
Electronics Forum | Mon Jun 01 17:41:20 EDT 2009 | gregoryyork
What is your squeegee pressure and size. Also does the pad sit on a ground plane, as it looks like it is partially reflowed so surface has gone but not coallesced properly which would indicate it is more a problem with reflow above 217-219C OR obviou
Electronics Forum | Wed Aug 26 05:22:59 EDT 2009 | grahamcooper22
Hi Sergey, I agree with your probable cause. Maybe if you still have a component you can bake it before reflow to DRY it. Then if the problem doesn't happen in reflow you have surely proved the cause. Consult IPC JEDEC 33B spec for storage and Drying
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