Electronics Forum | Sat Aug 25 08:36:54 EDT 2018 | davef
I think if you're having this problem with one supplier and not the other, then you should start there. Work with that supplier to make things correct.
Electronics Forum | Thu Aug 30 12:31:26 EDT 2018 | emeto
We all agree that you have a PCB issue. It would be for the best if you use a lab to investigate a few of these PCBs. It would be interesting to investigate the plating specs and contamination levels. For a start you should insist on proper packaging
Electronics Forum | Tue Sep 04 14:02:35 EDT 2018 | elsabudz
Hi Peter, I read your concerns regarding IC parts not packaged with desiccants and thought you may find our new Type 2 Humidity Indicator card of interest. Please visit https://www.clariant.com/type-2-humidity-indicator-card Thanks, Elsa
Electronics Forum | Thu Oct 18 12:14:55 EDT 2018 | edhare
Thin or non-uniform HASL can be checked with SEM/EDS analysis, e.g. https://www.semlab.com/bad-hasl/
Electronics Forum | Wed Nov 21 05:57:30 EST 2018 | premkumar_haribabu
Hi Robl, Thanks for your qucik reply!! , i understand if we use aggresive flux that we can impove solder wetting over nickel plate vs PCB pads & we need to solder through 12 zones reflow oven. Prem
Electronics Forum | Thu Nov 29 13:22:39 EST 2018 | roblackey
Hi Evtimov, For BGA's you place 4 on each side right outside the edge balls and it pulls the case down and a bit is pulled between the balls on reflow. Not tried gluing a crystal (they only gave me a strip to play with)
Electronics Forum | Fri Jan 04 08:02:03 EST 2019 | ameenullakhan
Hi, Thanks for the valuable feedback. We are at lower spec : ( TAL )Reflow time : Around 50 Sec ( Above 217 deg C) Peak Temp : 240- 245 deg C. Any other suspects. And your English is fine :) Regards, Ameen
Electronics Forum | Wed Feb 13 08:15:05 EST 2019 | SMTA-Joe
We recently had an in-house demo with the smaller IR bottom heater PACE machine. The machine was barely able to remove some components, but could not replace new ones at all. Also, the nozzle for the hot air would not fit in the tight areas of the ho
Electronics Forum | Mon Feb 18 07:52:09 EST 2019 | SMTA-Joe
Would increasing the thickness to compensate be a reasonable soulluction? This tarnishing is happening after the first time heat is applied. Could it be a factor of too long in ramp and/or soak?
Electronics Forum | Mon Feb 18 10:11:27 EST 2019 | davef
Whose process is your fab using? Contact [MacDermid, Electrochemicals, In, whoever]
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