Electronics Forum | Tue May 18 08:37:48 EDT 2021 | jtautomation
Shenzhen JT is a leading intelligent equipment and advanced manufacturing system supplier that integrates R&D, production, sales and service. Shenzhen JT is established in July 1997,listed on 10 Oct.,2014 (Stock Code 300400),registered Capital
Electronics Forum | Thu Jun 10 13:29:21 EDT 2021 | edgar_smt_ap
Good morning. What should be the Oxygen content Standard in an Oven? Here in my company, we have an ERSA reflow Oven, and we work with Lead Free solder paste. According to Work Standard documents send by my company corporate, the PPM Oxygen conte
Electronics Forum | Wed Dec 22 17:49:06 EST 2021 | mihai_voivod
I have this part: 142-1711-801 (Emerson). It is an SMT/TH part. https://www.digikey.com/en/products/detail/cinch-connectivity-solutions-johnson/142-1711-801/9992851 I want to reflow the part instead of hand soldering and/or reworking the solder jo
Electronics Forum | Wed Jun 29 12:31:32 EDT 2022 | proceng1
I don't know about that paste, but I can give my experience trying intrusive reflow (pin in paste). Using standard Lead-Free paste, we often had issues. It seems that many ROHS parts can't actually handle reflow ROHS temperatures. So the fact that
Electronics Forum | Thu Oct 27 22:26:37 EDT 2022 | philippg
Hi guys, I am thinking of buying a used Ersa IR/PL 650. I have read in some threads, that it is quite a good and reliable rerwork station. My usecase is mainly high mass pcbs. In the description of the manufacturer it states, that this station is mai
Electronics Forum | Fri Feb 16 09:01:05 EST 2024 | emanuel
I am confused about the parameters of the reflow profile needed to solder lead free components. We assemble boards for automotive modules required with leaded solder paste. The boards have ENIG finish. The problem is that I see some wetting issues, v
Electronics Forum | Thu Mar 02 07:38:58 EST 2000 | Roni Haviv
Hello, I had experienced this kind of problem; Because the Au film is very thin (flash gold..) it is sometimes porositive and the Ni barrier below get Oxidation. After reflow there seems to be good solder fillets (visualy perfect!) but the leads wit
Electronics Forum | Thu Feb 24 14:58:11 EST 2000 | Greg denham
Does anyone have any information on baking boards to remove moisture before reflowing and waving assemblies? I've been told that we should do this to stop such problems as delamination of boards, blow holes, solder balls, etc. I don't know have any e
Electronics Forum | Wed Feb 23 16:38:41 EST 2000 | Michael Parker
I have experienced tombstone with one brand of 0603 capacitor. Swapping in another brand (actually two different brands to date) has stopped the tombstone. I have measured the parts (length, width and height). There does not appear to be any apprecia
Electronics Forum | Fri Feb 11 08:51:45 EST 2000 | HMAL
Dear Masdi, Perhaps you should check again your screen print process. Small amounts of solder paste under stencil can cause your problems. This paste is from previous printed pcb. When printing next pcb this paste attachs to places that it doesn't
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