Electronics Forum | Wed Oct 03 17:08:32 EDT 2001 | davef
No comment or intent to appear critical on your particular situation, because you did the troubleshooting to determine the source of the problem, but �solder on the component lead, but not on the pad� is more often caused by a reflow profile that get
Electronics Forum | Wed Oct 03 12:02:04 EDT 2001 | kjwaskow
We are getting solder blobs forming in open areas of the BGA, between the center array and outer array. THe ceter array balls are starved of solder, so they are presumably the source. The theory we hold is possible moisture causing the solder to mo
Electronics Forum | Fri Oct 05 08:11:32 EDT 2001 | PeteC
Steven, Batch vs. conveyorized is all about production rate. The conveyorized tend to deliver higher production rates. The conveyor runs at a constant speed. You must use a "profiler" device to establish a recipe for the product you want to solder.
Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua
I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g
Electronics Forum | Wed Oct 17 18:42:37 EDT 2001 | scott
Any processes that I need to be aware of that differs from standard FR4 during reflow and wave soldering? I've read one of the problems is the thermal expansion of teflon is quite different from copper. I've also seen a "blurb" where teflon absor
Electronics Forum | Fri Nov 09 20:15:26 EST 2001 | caldon
I concur with Dave.....I have done this often with little fall out. After rework reflow we would x-ray just to ensure an acceptable joint structure. Just for curiosity sakes....are you removing a defective BGA and replacing with a good one? Site pre
Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef
Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo
Electronics Forum | Tue Dec 18 20:45:09 EST 2001 | davef
This sounds goofy. That is too much side-to-side del T, even for a 1088. Something is wacked with the machine. Contact Mark Peo at Heller. Search the fine SMTnet Archives for his contacts. He's a good guy. Alternately, how much do you like pall
Electronics Forum | Tue Dec 18 23:43:38 EST 2001 | Dreamsniper
Hi Dave F, Tried to use Contaval Pallets but it only worsens the situation. Prior to the retrofit of the Edge Hold Conveyor, our oven profiles were running well. It is probably due to the retrofit as it made the pcb 30mm farther from the bottom heat
Electronics Forum | Thu Dec 20 14:14:16 EST 2001 | Dreamsniper
Hi Dafe F, The edge hold conveyor was installed due to the double sided process on our new products. Remember the Stencil Printing Adhesives versus Dispensing in the forum a year ago? Well that led us to acquiring a Camalot 3800...This time it's the
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