Electronics Forum | Wed Nov 07 09:19:16 EST 2007 | pjc
Could be not enough peak temp. Do you have a profiler? I'd measure at the BGA joints- drill under board to get access to BGA solder joints and embed a couple of thermocouples with hi-temp solder, then run your profile to see max. temps. and that prof
Electronics Forum | Wed Nov 07 18:11:44 EST 2007 | jmelson
I can't answer for wave, but we tried some Sn100 paste for reflow, and couldn't get it to work worth a darn. I then got some SAC305, and was relieved to see it work almost as well as SnPb at its best! Much better wetting and flowing to the various
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | russ
Could be any one of the 3 you mentioned, need some details here, do you really think we can answer this question as it is? Now for your issue, what is the make up of the lead itself on the part? what is the reflow profile at this part? what is
Electronics Forum | Mon Nov 12 19:47:33 EST 2007 | sin4d
Hi, Thanks. Waitng for your reponse. BTW, if I were to perform a test as below will this give me some result to indicate if the component is defective. 1) Print solder paste on plain PCB without copper track. 2) Mount the QFP & reflow 3) If the sol
Electronics Forum | Sat Nov 17 18:16:46 EST 2007 | jwsmt
You mention moisture in the part as a cause of cracking during reflow. What does this type of crack look like? How was it determined that moisture was the culprit? The resonator is near the middle of the PCB, but is about 5mm from a large hole (abo
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
Electronics Forum | Sat Dec 01 21:59:35 EST 2007 | kenferrer
Hi Eng. Yumex in our company we're using 9 zones air convection oven. When the technology on Lead Free came along conversion from non-lead free to lead free viceversa was frequently done but there's no problem on contamination. Where is your company
Electronics Forum | Wed Dec 05 09:26:56 EST 2007 | ratsalad
Ms. Chunks, You are correct nobody mentioned anything about RoHS. And, right or wrong, our quality department's official stance is that "the only thing about RoHS we have to be concerned about in our industry is Pb". It is not just our quality dep
Electronics Forum | Wed Dec 05 10:46:54 EST 2007 | realchunks
If you only manufacture PC Boards with valid RoHS compliant componenets, then yes, your Pb is your only concern. If you add any type of other fastener, housing, wire, etc... it also must be RoHS compliant to be certified. Too many people focus on "
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