Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado
We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar
Electronics Forum | Tue Feb 11 11:31:52 EST 2003 | Chad
My small R&D company (15 people) is considering the purchase of a bench top reflow oven & associated gear. The reasoning is that it would be nice to have reflow capability for 5 to 50 piece prototype runs in-house. As the only person with any real kn
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Tue Jun 28 10:51:32 EDT 2005 | mattkehoe
Thanks for the replies, - solder paste used ? NC ? other ? Water soluble 63/37 paste - reflow in Air or N2 ? Infrared - temp ramp up before soack (�C/second) ? Will have to check. This profile has been used on numerous gold plated boards in our
Electronics Forum | Wed Jan 04 10:34:04 EST 2006 | DannyJ
I don't believe you are missing anything, Amol. Mainly, you just need to make sure that your oven handles the higher temperatures needed for reflow. Also, there has been a lot of discussion on how many zones are needed to properly reflow lead-free
Electronics Forum | Wed Jan 04 13:59:14 EST 2006 | chunks
Ask your customer why they need this? Show them your process. Then bury them in their own unknowledgeable requests. It is pretty scary how many papers are also written about how easy it is to reflow a lead-free BGA with regular leaded paste. ht
Electronics Forum | Wed Jul 19 21:11:40 EDT 2006 | ec
Hi Dave, Sorry that I did not explain clear enough. What I mean normally after reflow, the solder joint is very smooth and there is wetting. But now we see there is hole on the solder surface and is not on the same loaction. This product have been r
Electronics Forum | Fri Sep 08 11:29:40 EDT 2006 | GPP
James, What type of profile are you using. Ramp-to-Spike, Ramp-Short Soak-Spike, or Long-Low Spike? I had a similar problem in a past life - random skews on chip components - and got rid of it by converting to Ramp-to-Spike (the old profile was R
Electronics Forum | Tue Jun 18 23:24:05 EDT 2019 | SMTA-David
Hi, I have a SMD radio module that has castellated Pads along one edge of the module. The pick and place machine appears to place them very well but when the boards come out of the reflow oven then up to 20% of them have either rotated a few degrees
Electronics Forum | Thu Jul 25 23:59:37 EDT 2019 | vickygao
Hi, According to your information,5 zones reflow oven can't meet your requirmens now.We advice use 8 zones rlow oven. These times we designed a new 8 zones reflow oven, more economic,more power save.And function is better than old units. I m a sal
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