Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F
Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen
Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik
Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting
Electronics Forum | Tue Nov 02 11:44:54 EST 1999 | Wolfgang Busko
Hi Pat, is the soldering Ok when you solder them by hand ? We use some larger ferrite beads with no problems in reflow but I must say that we use a vapour phase and only max 5 parts/PCB. They do have a high thermal capacity and you use a lot of them,
Electronics Forum | Mon Nov 01 15:47:21 EST 1999 | Jim Snipes
Dave thaanks for your quick reply. The flow through probelm exists on several component, Examples; small Tan electolic caps.,electrolic epoxy caps. and one specfic lad on a resistor network. I have veried conveyor speed and readjusted heat sett ings
Electronics Forum | Thu Oct 28 17:46:44 EDT 1999 | Gary Kemp
My company manufactures memory modules and I'm finding solder specs on the gold fingers following the reflow process. We are using a no-clean solder paste. The spec sheet warns against crossing the 140 degree C mark during the soak stage, preventin
Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May
We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Fri Oct 15 11:05:50 EDT 1999 | Mark Phinney
Earliar we had problems with board warpage, Much of our problem was due to imbalances in the copper on oppisite layers in brief on a 8 layer board the copper on layer 1 should = the copper on layer 8, 2=7, 3=6, 4 = 5. We added copper to some layers t
Electronics Forum | Tue Oct 12 16:38:24 EDT 1999 | Charlie
At present the band-aid fix is using epoxy 'dam' under the part and masking over the part to pervent excessive current leakage conmonent failure. These parts are first going through the reflow oven, where the epoxy dam is used to over come the leakag
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