Electronics Forum | Mon Mar 24 08:57:20 EST 2003 | russ
I don't know if I would call it a "blow hole". what I believe happens (I don't have a camera to watch spheres during the reflow process) is that when the flux starts heating up, expansion, bubbling, or something physically displaces the balls. We fo
Electronics Forum | Sat Mar 01 08:17:40 EST 2003 | davef
You're correct that the FR4 is probably the best choise. The majority of the problems in developing your reflow recipe is going to come from the CTE mismatches in the CCBGA , CBGA and PBGA that you put on the board. The other side says given the pr
Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing
Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your
Electronics Forum | Thu Mar 06 18:21:29 EST 2003 | ppwlee
Mike, What is the most common method for monitoring and calculating machine capability for: - Reflow oven, I currently run a carrier monthly to monitor its temperature profile and would like to simplify the process. - P&P machines: We don't have a
Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny
Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov
Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto
Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v
Electronics Forum | Tue Mar 18 11:51:24 EST 2003 | slthomas
I like this answer! Part geometry, part mass, land pattern, print accuracy, reflow profile, placment accuracy, and aperture shape all play a role. If you use a homeplate to reduce solder balling, have high profile/low mass parts AND place more to
Electronics Forum | Tue Mar 18 16:41:04 EST 2003 | russ
Here is what I have been finding lately. We switched to a 22mil square pad on 40 mil centers (from the IPC "75/25"). ALL OF OUR TOMBSTONES HAVE GONE AWAY! (at least for now) we did not change profiles, paste, or any other parameter. Obviously placem
Electronics Forum | Wed Apr 09 14:52:20 EDT 2003 | russ
If you really think the vast majority of these are going to fail I think that doing them all in one shot is the best thing. That way, as you stated you only have to reflow the remaining parts one more time instead of 22!! i hope you only have one b
Electronics Forum | Thu Apr 10 14:35:18 EDT 2003 | russ
What flux are you using to put them back on? you should be able to adequately clean the site after removal with alcohol or water depending upon the type of flux. "White grungy" usually comes from a liquid flux such as Alpha 857 being squirted on th
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