Electronics Forum | Wed May 12 11:55:08 EDT 2010 | pbarton
We are using VPS, but only for high mass assemblies. As the other respondent has suggested if the mass of the assemblies is very low then difficult to control temp. rise times to within the normally accepted parameters. The Rehm equipment does seem
Electronics Forum | Wed May 12 17:54:22 EDT 2010 | jlawson
Just a note, on fixed galden machines yes the way they compensate for rise time is as the previous post suggested, change power and also stage the lowering of the PCB into the vapor cushion ie not the main one but further up in the tank. The disadvan
Electronics Forum | Fri May 21 15:45:29 EDT 2010 | pforister
iv40, Thanks. The PCB that we are populating the BGA hybrid onto does not have holes in the vias. I think the manufacturer indicated that on their hybrid it has holes in pads. This hybrid is a PCB assembly with BGAs and other components populated
Electronics Forum | Tue May 25 18:07:22 EDT 2010 | jlawson
Vacuum Soldering is mostly available with Vapor Phase Soldering systems as a option. Asscon / IBL / Rehm Thermal all offer this... Rehms system is unique as they offer in place solder and vacuum vs the other two vendors that move a PCB with Molten
Electronics Forum | Mon Jun 14 10:23:53 EDT 2010 | pcrane
I have CCA that has a SN100C HASL coating that I am wave soldering with SbPb. I have mounting pad areas on the CCA that are masked with a pallet during reflow so they are not exposed to the solder. The mounting pads are turning gray in some areas of
Electronics Forum | Tue Jul 13 13:37:23 EDT 2010 | pjc
That's cold compared with this specification from a leading oven mfr.: Flow Rate - 1.0 - 3.0 US gal/min (3.79 - 11.4 l/ min) • Inlet size and pressure - 0.5 in. male NPT; 310 - 483 kPA (45 - 70 psi) • Pressure drop - 200 kPa @ 11.4 l/min (30 psi @ 3
Electronics Forum | Thu Jul 15 04:33:56 EDT 2010 | jevans
We've recently purchased a second hand smt line which contains an Ersa Hotflow 9 reflow oven.We were informed that this oven was capable of handling a lead free process.The oven was manufactured in 2000,and it has come to our attention that it can on
Electronics Forum | Tue Jul 27 08:03:55 EDT 2010 | scottp
You have to figure this out for yourself for your paste. When I evaluate solder pastes I require good tack, no solder balls, and proper wetting after 4 hours at "reasonable" ambient conditions. I also print boards and put them in a temp/humidity ch
Electronics Forum | Sat Aug 07 09:32:54 EDT 2010 | scotceltic
We have a Large LGA package (40mm X 40mm) that we are trying to process on a double-sided assembly. problem is the only space we have for it is on 1st side processing side. Therefore we have worries about falling off in the oven during the 2nd side
Electronics Forum | Thu Aug 12 11:00:42 EDT 2010 | hegemon
Without seeing a picture, my first instinct would be first and foremost some fixturing that provides full support for your print process. After that, since you are citing bow and twist, consider that the fixturing might as well travel through the ov
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