Electronics Forum: reflow (Page 751 of 945)

Re: Reflow Profilers

Electronics Forum | Tue Oct 27 04:19:40 EST 1998 | Mark

| | | | What are the key feature to look for in buying a profiling product for Reflow ? | | | | | | Who's is the best and how much do these systems cost ? | | | | | | Thanks in advance. | | | | | | Hi Mark, | | | | I am currently the oven secto

Re: Help with new placement equipment

Electronics Forum | Wed Oct 14 22:05:45 EDT 1998 | Jason

John, Universal has a smaller footprint HSP chipshooter, I believe the 4795S and the 4796R that takeup a lot less space than the full sized chipshooters do. I have a 4795S, it's just as reliable as our full sized 4795's & 96's. As far as BGA's I pr

Re: Reg: Voids in solder bumps

Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen

Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing

Need advice on fixturing a smt LED board

Electronics Forum | Thu Sep 03 15:43:18 EDT 1998 | Tim Flanagan

I need advice for locating 23 Gull wing LED's (all in a straight line) in the x,y, and z axis for a SMT PCB. It is a Hewlett Packard LED (P/N HMLA-QH00-01). The application uses a CCD to detect the position of a ball which floats in a resevior for

Re: Solder ball bridging under BGA

Electronics Forum | Wed Nov 11 10:08:38 EST 1998 | Magnus

| | Hi, | | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent

Re: Bob Willis Free Advertising

Electronics Forum | Fri Aug 07 02:30:08 EDT 1998 | Bob Willis

| | No sour grapes, | | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely on t

Re: SMT process benchmarks??

Electronics Forum | Wed Jun 10 18:50:36 EDT 1998 | Earl Moon

| | | Does anyone have any info./studies on what the percentage or PPM defect rates are for each part of the typical SMT process. | | | Example: | | | Screen Print = 45% of total defects | | | Component Placement = 25% of total de

Re: Micro balls on gold fingers

Electronics Forum | Mon May 18 21:29:38 EDT 1998 | D.Lange

| I've tried every thing I can think of. Do you have any | Ideas? | What I have is micro balls on the gold fingers of | panelize boards. These balls only appear on the gold | finger. Or at least I can only find them on the gold | fingers. | What I

Re: Drying ICs any advice

Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Wierd Tombstoning on Tant Caps

Electronics Forum | Fri May 01 14:00:59 EDT 1998 | Chrys

I've never seen this before. Today, I got this tombstoning on Tantalum Capacitors (Okay, I saw that before) Here's the part that seems weird to me: -They didn't tombstone onto a termination - they went onto their sides! That's right, both terminati


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