Electronics Forum | Tue Apr 15 15:10:28 EDT 2008 | markhoch
We currently are using an older Electrovert Convection 7-Zone reflow oven for our Lead-Free assemblies. It has a maximum per zone Temperature setting of 280 Degrees C. This is causing an issue with one particular customer who has a fairly dense produ
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
Electronics Forum | Sat Apr 04 03:24:41 EDT 2009 | monduran
Our company is in the market to replace the $50 toaster oven we use to reflow boards with something that can actually achieve even temperature and a proper reflow curve. We are a RnD type company and have no need for volumes. Though we have some heav
Electronics Forum | Sat Aug 01 12:06:52 EDT 2009 | isd_jwendell
Unfortunately, I don't see any image. If your part will survive 300C then even convection reflow should work. The use of paste and reflow ovens are for when you move to production quantities. It sounds like you could hand solder your prototypes (proo
Electronics Forum | Tue Jul 28 07:42:07 EDT 2009 | Mike Konrad
Hi Sean, No-clean flux does leave a residue. Under the best conditions, it is invisible. There are many factors that can cause the residue to become visible such as an inadequate oven profile (or lack of proper preheat on a wave). Also, if wave s
Electronics Forum | Wed Sep 16 18:25:47 EDT 2009 | larob57
(http://forums.xbox-scene.com/index.php?showtopic=691556) I can make some more pic's for you to see and I will post them in photobucket.Go to my page at this link and then click on my album (http://s1007.photobucket.com/albums/af192/repairman52/)
Electronics Forum | Thu Nov 19 13:01:40 EST 2009 | deanm
I'm assuming that 18k components per month represents less than 100 boards per month. I've worked for both OEMs and CEMs and if your design is stable and your volumes are relatively stable I would highly recommend going with a CEM given the low volum
Electronics Forum | Thu Nov 19 05:18:37 EST 2009 | prodivegsr
Hi All, Recently we are working on the conformal coating process using Humiseal chemical 1B73 and thinner 521. Bubbles on component body/joints are seen after gone through the IR Reflow Oven. During the conformal coating, only tiny bubbles seen af
Electronics Forum | Tue Mar 23 10:46:48 EDT 2010 | oeidave
Hello Sibbe, Thank you for posting your questions. There are a few approaches to AOI with the majority being program driven. There are a couple of systems that are simply comparative in that you use the system to compare a golden board to others th
Electronics Forum | Wed Aug 04 11:01:46 EDT 2010 | ooskii
I have a question concerning what plating will go into solution during the reflow process. I am soldering a small piece of ceramic (120x180 mils 7 mil thick) onto a flex circuit. I am seeing some fractures that I am sure are being caused by handlin
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