Electronics Forum | Tue Aug 22 10:53:45 EDT 2000 | Dr. Ning-Cheng Lee
Excellent question. Alloy development is relatively easy compared to flux formulation. New fluxes for Pb-Free alloys need upgrades in 2 critical areas: 1) thermal stability 2) oxygen barrier efficiency Since the Pb-Free alloys require reflow proce
Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Thu Jul 20 12:44:21 EDT 2000 | Ketan Bhatt
We have difficulty in placing a trimmer capacitor chip using our Philips CSM 84 VIII pick and place machine. This Trimmer capacitor is supplied by Murata and its partno is TZBX4P300BA110T00 and value is 4.7~30 pf. While trying to place the componen
Electronics Forum | Mon May 14 19:16:49 EDT 2001 | jagman
Dave: Actually, I'm located in the South Bay (Santa Clara)! Good guess. Now, for more in-depth information: So far, the distribution has been limited to one board out of 10 assembled, so far from one lot. The components assembled are exclusively
Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef
IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Sun Jun 10 12:47:36 EDT 2001 | procon
Hi Jacob, NC vs WS, what a story! No-clean paste means no-clean for your products but what a mess it makes in your reflow systems. If you are a contract maunufacturer of high volume production, then No-Clean is they way to go. This helps keep your co
Electronics Forum | Tue Jun 12 20:59:14 EDT 2001 | ianchan
Hi mates, actually my whole problem, is whether to : 1) To offset the heat-absorb ability of the Pallet, that artifically lowers my pcba temperature, is it advisable to artifically increase the overall, oven zone temperatures? offset by estimated +
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Mon Jun 11 14:25:36 EDT 2001 | CPI
I had the very same problem but, did not question my oven as I knew the profile was good and I should have had even heating. So I then looked at pad size and layout. When Layout and size were found to be ok. I attached a prob to each pad and ran a pr
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