Electronics Forum | Mon Sep 13 12:31:41 EDT 1999 | Wolfgang Busko
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Tue Sep 14 09:13:34 EDT 1999 | Chris McDonald
| | | Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | | | | | | | | | Hi Chris, | | Why don't you process a double side reflow and use selective wave fixture for wave process. T
Electronics Forum | Wed Sep 08 17:25:49 EDT 1999 | Earl Moon
| My company is looking to perform "real time" statistical process control on our current SMT operations. I have identified the critical processes for SPC but have not had much luck in finding a system(s) that can monitor the required processes for m
Electronics Forum | Thu Sep 09 08:33:07 EDT 1999 | Dave F
| My company is looking to perform "real time" statistical process control on our current SMT operations. I have identified the critical processes for SPC but have not had much luck in finding a system(s) that can monitor the required processes for m
Electronics Forum | Thu Sep 09 14:40:33 EDT 1999 | Doug Philbrick
| | My company is looking to perform "real time" statistical process control on our current SMT operations. I have identified the critical processes for SPC but have not had much luck in finding a system(s) that can monitor the required processes for
Electronics Forum | Thu Sep 02 10:35:46 EDT 1999 | Gian.D
We are assembling double side pcs reflowing (smt) on top and by wave on bottom. After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. After wave soldering we f
Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko
| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a
Electronics Forum | Thu Aug 26 10:28:07 EDT 1999 | Stuart Adams
What are the key steps to achieving high yield with CSP ??? (We are trying qualify vendors for volume fab/assembly of some products which use several CSP devices on each side of the board. (Some with 0.5mm ball pitch)) Looking through the forum I
Electronics Forum | Fri Aug 27 13:24:19 EDT 1999 | swsng
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Wed Aug 25 07:53:08 EDT 1999 | Scott Davies
| | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | Any help would be appreciated. Thanks. | | | Most common reason is uneven heating where one side of the com
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
4 Vreeland Rd.
Florham Park, NJ USA
Phone: 973-377-6800
