Electronics Forum | Thu Feb 28 16:40:04 EST 2002 | liviuj
>Dear SMTneter, >>I am loonkig for some information about how to rework a >>BGA. >>Some technical info explaing how to put solder past >>manualy, soldering manualy, tips and so on. >>Where can I find something about? >>Thanks in advance >>Marcos Hi
Electronics Forum | Wed Mar 06 17:15:06 EST 2002 | djarvis
Hmmmm, very good point. I never thought about it much as such dedicated tools were not available when I first kicked off. I'd look at the reflow under a microscope and if I could identify any problems, I'd start to look at the print using the same
Electronics Forum | Thu Mar 07 15:38:34 EST 2002 | kg
I can point to at least one recent study with contrary evidence that 60% of SMT problems are printing problems. The study is published in the APEX 2002 conference proceedings, a joint effort between Aglient and Nokia entitled 'Paste Inspection Study
Electronics Forum | Wed Mar 20 11:47:06 EST 2002 | Hussman
Ron, Some places want/need oven calibration and some don't, just need a profile. I've worked for both. If you need oven calibration, an easy, inexpensive way is to parallel thermalcouple wire to your existing thermalcouples. Terminate the ends of
Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef
I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti
Electronics Forum | Thu Aug 08 10:58:18 EDT 2002 | Tom Gervascio
I'm interested in sharing any information on bumping of LAnd Grid Array (i.e. QFN) packages. due to PCB contraints, it's not possible to stencil paste onto sites for QFNs. That lead to a lot of experimentation with bumping of 6 mm QFN packages.In sum
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Wed Apr 17 18:18:52 EDT 2002 | bsteelglove
I recently bought a DEK 265 Mark 1 on the used market for $1,500 dollars along with a ABW 1210 Reflow oven which I really wanted. I knew the DEK had not been refurbed but that was fine because I was willing to pay there extremely high prices to have
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Thu May 09 17:28:33 EDT 2002 | davef
There is no IPC specification, nor should there be. * There are just too many peculiarities in the design and fabrication of PWB. * The issue is not defining how to store boards. The issue setting expectation for reliable products and allowing you th
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