Electronics Forum: reflow and profile and for and glue and curing (Page 1 of 1)

Reflow glue and past.

Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie

I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F

Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean

Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de

  1  

reflow and profile and for and glue and curing searches for Companies, Equipment, Machines, Suppliers & Information

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications


Best Reflow Oven
SMT fluid dispenser

回流焊炉