Electronics Forum: reflow and profile and solder and balls (Page 1 of 11)

Intermetallics and reflow profile

Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe

I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto

I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied

Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run

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