Electronics Forum | Wed Aug 07 12:35:36 EDT 2013 | cyber_wolf
I was asked how we verify that the thermocouples INSIDE the reflow oven are calibrated. That seems pretty impractical to me. Has anyone come across this ?
Electronics Forum | Thu Aug 08 13:09:38 EDT 2013 | cyber_wolf
Hege, there is no actual calibration of the thermocouple itself. You can however verify that they read correctly. Heller sells an option on their reflow ovens specifically for this purpose. I hoping that someone chimes in here that is NADCAP certifi
Electronics Forum | Tue Oct 17 21:14:14 EDT 2000 | hankey_cn
Who can tell me the IPC** about the thermocouple for reflow and rework? I'm waiting....
Electronics Forum | Tue Feb 19 09:41:26 EST 2008 | slthomas
ECD sells the MOLE, and they sell both the Oven Rider and the Wave Rider to accompany it. The thing is, you can profile both an oven and a wave machine without either if you're willing to just solder your thermocouples to a board. The nice thing ab
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Tue Aug 13 02:33:04 EDT 2019 | ameenullakhan
Hi , Thanks for the reply. Yes CCGA was checked before placement and sending to reflow oven. The latest suspect form few cross functional team member is like. It is due to improper reflow profile " Column kick out " has happen. I am
Electronics Forum | Wed Jul 31 07:51:31 EDT 2019 | ameenullakhan
Hi Dave, lead is 80Pb/20Sn. Top joint off CCGA lead is SN63/Pb37. Thermocouple was placed at center lead of the CCGA and one at the corner lead of CCGA. Ramp Rate Center 1.09 Corner 1.26 Soak ( 140 - 160 deg C ) Center 37sec Corner 38sec Ref
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
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