Electronics Forum | Wed Jul 02 19:06:21 EDT 2003 | Adrian Espinoza
Last week on my company we began a production for new model. Today we identify a possible non-conformance solder appareance. I have a picture for this defect to show the condition.
Electronics Forum | Wed Jul 02 21:40:44 EDT 2003 | davef
Email me your pix Here how one SMTnetter posted pix: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6046Message24067
Electronics Forum | Wed Jul 01 11:48:30 EDT 2015 | sssvajunas
We use component BFU730LX and we have one problem. After reflow transistor base or collector lands are not soldered. Maybe someone have similar problems with this component? We tryed to change stencil pads (smaller , bigger) but problem is the same.
Electronics Forum | Thu Dec 14 11:49:37 EST 2017 | barryg
When the board is populated on the second side, and after reflow, components are shifted, skewed with solder flowed on the leads of the components and not on the PCB land.
Electronics Forum | Thu Dec 14 13:46:34 EST 2017 | emeto
Now, if before reflow everything looks fine, something happens in the oven. As it is second side, I would ask if there are parts close to edges or very tall parts on the first side that might be getting in contact with something in the oven? In my o
Electronics Forum | Wed Aug 01 08:58:02 EDT 2018 | 2219576
Please check the solder paste height near PCB edges, Please check board clamping during solder paste printing. Please check tooling support boards must be fixed during the printing process. try to set wiper cleaning frequency and fine tune for best
Electronics Forum | Sun Sep 15 08:35:42 EDT 2002 | davef
That 60+% print defects number has been bantied around for so long in the electronic assembly business for so long that people believe that it's true. One starting point for this myth and lore is: "Where Quality Is Lost On SMT Boards" C Mangin, 'Cir
Electronics Forum | Sun Sep 15 15:08:00 EDT 2002 | jersbo
My 2 cents... Screen printing may very well have a leg up on deciding SMT defects... however if you pay attention to your stencil (aperture size ratio etc..) and inspect your prints... I believe its a much lesser number... (paste MFG also plays a ro
Electronics Forum | Thu Dec 29 09:03:03 EST 2016 | sumote
I would cut a piece of cardboard to the same dimensions as your circuit card. Run that through the fluxer of your machine and pull it out before the pre-heater. Take a look at the cardboard and verify that flux has been sprayed on it. That board look
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
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