Electronics Forum: reflow problems (Page 1 of 233)

double sidded reflow problems

Electronics Forum | Mon Aug 13 16:12:10 EDT 2007 | judym

Thanks for your input........When my guy gets in tomorrow I will pass on the info....

double sidded reflow problems

Electronics Forum | Mon Aug 13 18:17:44 EDT 2007 | chrisgriffin

Glue is good....

qfp reflow problems

Electronics Forum | Thu Apr 22 14:15:35 EDT 2004 | russ

Well so much for being too hot! Try kicking your max temp up to 220, I wouldn't extend the duration however. I would almost start to think that this QFP has a pb free finish. Let us know what happens Russ

qfp reflow problems

Electronics Forum | Fri Apr 23 12:47:29 EDT 2004 | barry

I have increased my peak to 220, and Flow is better, but it still not quite a good fillet all around. The solder tends to kinda "bunchup" at the toe of the lead. If part is Pb free, would this affect adhesion and or flow?

double sidded reflow problems

Electronics Forum | Mon Aug 13 08:00:46 EDT 2007 | davef

Are the components that fall from the board solderable? Is the board solderable? Where is the solder for the components that fall from the board [eg, on the pads, on the component]?

Conceptronics oven reflow problems

Electronics Forum | Wed Jan 07 13:17:56 EST 2004 | James

We currently have 2 HVA 102 conceptronic reflow ovens. I ran 2 profiles on the 2 seperate machines. One of the oven ran 7 degrees lower than the other oven. I checked all the fans and they seem to running fine. I get no warning on the monitors.

double sidded reflow problems

Electronics Forum | Fri Aug 10 14:43:27 EDT 2007 | judym

When running some double sided reflow boards through the Heller oven, some of the caps/ res's are falling off the bottom side of the board. I understand if the parts are too heavy they wont stay in the molten solder, but these particular parts are no

qfp reflow problems

Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry

Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which

qfp reflow problems

Electronics Forum | Thu Apr 22 12:27:47 EDT 2004 | barry

I placed thermo's at 2 of the problem devices. Soak (time 150 to 180) 100 sec. Time above 180 =80 secs with 208 deg. peak. The solder appeared to flow at these pads, but little to no adhesion to the joint.Total time in oven was 5 min. All other joint

qfp reflow problems

Electronics Forum | Fri Apr 16 08:49:07 EDT 2004 | Chris Lampron

Hi Barry, Your best course of action is to perform a thermal profile and determine exactly what the times/temps are in these locations. Try to match your profile to the recommendations of your solder paste. (Time between 130-160, Time over 183 and m

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