Reflow Soldering Oven

Electronics Forum: reflow profile for glue curing (Page 1 of 4)

change from reflow to glue

Electronics Forum | Thu Jul 12 10:23:30 EDT 2012 | blnorman

Check with your adhesive manufacturer. In a previous life we had one line that was either double sided reflow or wave following reflow. When it was ds reflow, we just shut off the wave. When it was reflow/wave, we kept the reflow oven on with the

Reflow glue and past.

Electronics Forum | Tue Feb 08 12:36:28 EST 2000 | Charlie

I'm looking for information from both those who do cure glue and reflow past with the same profile and those who have tried and decided against it. What were the problem? What are the limitations?

The glue with the holes...

Electronics Forum | Tue Oct 16 18:42:32 EDT 2001 | mparker

I go with DaveF's advice. You are probably curing the glue too fast. Another phenomenon that I have experienced was during glue cure and solder paste reflow simultaeously. A good reason to run a glue cure profile seperately from solder paste reflow

Re: Reflow glue and past.

Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F

Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s

Re: Reflow glue and past.

Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean

Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de

The glue with the holes...

Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish

Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp

Does anyone remember the takt time formula for the reflow oven

Electronics Forum | Mon Mar 31 07:58:50 EDT 2008 | vinitverma

Assuming the following: L=Process Length of the oven t=Desired profile time in mins(depends on the paste/glue used) l=PCB length l1=gap between consecutive PCBs Then the total no. of PCBs per hour is" (L*60/t)/(l+l1) Vinit

Re: Curing of Glue for SMT Components

Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea

Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b

Profile for Glue "SOMAKOTE IR-130"?

Electronics Forum | Sun Apr 21 09:34:03 EDT 2002 | hany_khoga

Dear all: We need to glue some chip capacitors (0603 & 0805) before continuing the process of placing the topside SMT components. As a subcontractor we received the whole materials including the glue. After experimenting several temperature profiles

Video Recording for Reflow

Electronics Forum | Thu Aug 27 11:18:05 EDT 2015 | dyoungquist

From your description I am assuming you are doing double sided reflow and parts are dropping off the bottom side when the board is run through the reflow oven the second time. A few ideas to try: 1) Are the parts that are dropping off heavier parts

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