Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so
Electronics Forum | Tue Feb 19 10:50:13 EST 2019 | rgduval
Call Heller directly, and give them the oven, and relative thermal density of the board, as well as the solder paste that you're using. They'll be able to give you a baseline profile to start from (both RTS and RSS). Otherwise, use a thermocouple p
Electronics Forum | Fri Sep 21 21:43:16 EDT 2001 | dougk
We're used to placing the theromcouple on the solder joint and securing it with thermally-conductive UV adhesive. It's quick & easy to apply, and I've only seen a couple degrees difference from high-temp solder technique. Thoughts?
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Fri Nov 24 01:12:28 EST 2000 | SARRY
Hello! All I am an almost smt biginner. I have a few questions My question is 1. what will be changed to use lead free solder paste in a smt production line? 2. what is the reflow profile for lead free solder paste? Don't just tell me to search th
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Mon Dec 27 11:15:17 EST 1999 | g cronin
please send me a copy of sample reflow profiles for BGA packages. Please indicate the type of BGA and the Oven used. As well as any special characteristics of the assembly that have effected the profile. I a trying to learn more about the common "t
Electronics Forum | Mon Jun 13 04:26:00 EDT 2005 | Joris Groot koerkamp
For the lead free reflow process we tested with our Vitronics 500smr oven. To reach the high temperature of the lead free profile was no problem. We are not using an active cooling system so the pcb's are maby to hot wen the leaving the oven. Can an
Electronics Forum | Wed Mar 24 08:37:32 EST 2004 | steveliu
Hi, Guys, Can anybody tell me what kind of reflow profile is best for a no clean solder paste: Ramp-Soak-Spike or Ramp-to Spike? The paste we are using is AIM 293DX2B. Thanks a lot.
Electronics Forum | Mon Dec 04 15:37:51 EST 2000 | blnorman
Out of curiosity, what flavor lead-free paste were you using? That's also going to affect the profile.
