Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Electronics Forum | Sat Oct 01 01:04:47 EDT 2005 | ck
I face a problem where the components termination is non lead free but solder alloy is lead free. Thus i am using hybrid reflow profile. The specs for the reflow profile i am using: reflow temp. 120 to 160 deg C; time 90 to 120 sec. As for the pak te
Electronics Forum | Mon Apr 09 21:09:29 EDT 2012 | isd_jwendell
I haven't worked with anything as small as 01005s, but something you didn't mention is the %metal of your paste. I just switch from 90% to 89.5% (AIM NC257-2) and could tell the difference. Just an idea...
Electronics Forum | Fri Apr 13 16:52:07 EDT 2012 | hegemon
Hey Frazzled, you mean you don't prefer the back and forth flaming wars when someone disagrees with an opinion? How about "Agree" & "Disagree" for starters. Later we can add "YGTBK"(you got to be kidding), and "WP" (Wrong Planet) Great idea Frazz