Electronics Forum: reflow temperature at flexible board (Page 1 of 2)

SnPbAg solder paste at reflow oven

Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip

It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.

BGA Warping at the corners

Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon

You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside

Baking components at 70 degree

Electronics Forum | Wed Jun 18 13:08:52 EDT 2008 | sleech

Dave: You are spot-on right! The major hurdle is that 70 degrees C is below the boiling temperature of water. Only a near zero relative hudity chamber will cause the ingested moisture to migrate from a package. There is one facet of the 70 degree p

Tension on a SMT joint at the Solder wave process

Electronics Forum | Thu Nov 19 10:24:14 EST 1998 | Brian Co nner

Currently, I am having problems with a AMP Mictor connector at the wave process. These connectors have both SMT leads(topside) and thru-hole leads. Even though we have re-designed the board for via issues. We still see some of the SMT leads re-fl

Warming up solder paste at start of days production

Electronics Forum | Mon Jul 26 19:37:47 EDT 2004 | Grant

Hi, It was funny. The sight of 3 men standing around the microwave daring each other to push the start button, and then freaking out when the whole thing looked as though it was going to explode was funny. I guess you have to try these things! Tho

Batch Ovens

Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP

Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power

2-sided BGA

Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef

Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature

Re: Cold Welding Phenomenon

Electronics Forum | Mon Mar 09 10:12:43 EST 1998 | Justin Medernach

| Cold Welding | I'm presently doing a project on reflow profiling. | I came across this expression. Can someone please give me a definition. | Best Regards | Tom Mc Grath Tom, I think what you are referring to is also called cold solder. You have

Re: Board Warp And Twist

Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis

You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di

Batch Ovens

Electronics Forum | Tue Nov 08 19:10:18 EST 2005 | JeffP

No question that metal retains a lot of heat (slow to heat up and slow to cool down). But again in a batch oven, it mainly boils down to the heater. I know, until you see proof you are skeptical. I think by posting a url to product specs will

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