Electronics Forum: reliability (Page 116 of 241)

Maximum Rework per Board

Electronics Forum | Mon Feb 03 05:02:49 EST 2003 | Eugene

Hi all. One of our customers recently asked us during an audit of our PCBA rework line if we have a limit for the total number of reworks/repairs that can be done on one PCBA. We specify 3x maximum on one location of a major part (LSI for example). B

Voiding in CSP Ground pad

Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave

Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are

Voiding in CSP Ground pad

Electronics Forum | Fri Feb 07 16:10:14 EST 2003 | MA/NY DDave

Hi Gee, It seems funny to comment on your own post. I notice that the original poster and a respondent, like me, are striving to create some voiding by design to improve the way this joint will form. NEAT!! I still think that those vias as DaveF p

Intrusive reflow soldering

Electronics Forum | Fri Feb 21 19:49:36 EST 2003 | MA/NY DDave

Hi Good Luck Neil, When I first saw this process described, what you are experiencing was my first visual thoughts. Partial filling as well as huge solder voids inside of the joints. I figured for low reliability product or short life maybe this t

Solder paste change

Electronics Forum | Mon Mar 31 01:11:14 EST 2003 | yukim

Hi, we are about to change solder paste for cost issue. Currently using a no clean Sn63 solder paste and tried several others, all no clean, Sn63 and Sn62. Want to ask about reliability test: we did thermal shock test for 8 days. The flux residue cha

Panasonic Soft Beam Solder System

Electronics Forum | Wed May 07 18:08:10 EDT 2003 | kent_peterson

Steve, I onlyworked on the soft beam for a few months. With a good operator it ran good. The biggest problem i saw was the solder would break. The operators would try adjusting and end up moving the solder point. We had two machine back to back one r

Fuji CP4 and 0402 placement

Electronics Forum | Fri May 23 12:18:59 EDT 2003 | vortex

First off is your CP4 0402 ready? Before we could begin placing 0402's we had to have a vision upgrade. Once you have that or are sure your machine can handle 0402 then you will have to get 8x2 feeders. There may be a way to rig an 8x4 feeder but i'm

OSP Handling

Electronics Forum | Fri Jun 27 19:10:44 EDT 2003 | russ

Tina, I agree with Dave 100%, I also work at a contract house and the first thing we do is tell our customers our concerns with OSP. Usually what happens is we build the first lot with OSP since they are usually built already and all subsequent lots

Pinhole Solder Joint Reliability

Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef

bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip

Pinhole Solder Joint Reliability

Electronics Forum | Wed Jul 23 05:47:53 EDT 2003 | iman

Yo Thanks! right on the money pad, the pinhole occurs mainly in the (fillet's) top-surface central of the whole solder (fillet surface) area. Like you said, large surface area, lowest surface tension. that's a possible cause, that the potential voi


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