Electronics Forum | Sat May 14 17:25:20 EDT 2005 | fastek
"What can be done to create economical advantages over here is review the product flow and eliminate process steps with current existing technology. Process steps that can safely be eliminated are cleaning, visual inspection, post wave assembly etc.
Electronics Forum | Tue Jun 07 02:53:01 EDT 2005 | Base
Nope, not using it, but have some experience with it. Reliable, versatile, accurate. It is not in a league of its own, but it does everything you want it to at a level you expect it to. Never let me down. It is pretty much like a Toyota family car.
Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph
Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they
Electronics Forum | Thu Jun 16 18:16:32 EDT 2005 | davef
Josh: You're correct it's tough to describe the layout of the BGA pads and traces. We wouldn't be too excited about seeing this board either. On one hand, for the obvious lack of care taken in doing the layout, this is a junk board and you shouldn
Electronics Forum | Wed Jul 06 14:36:05 EDT 2005 | Bob R.
The only way we can consistently get a toe fillet is to use a paste with an extremely active flux. We allow that paste on certain products, but discourage it's use because it's on the hairy edge of not meeting our lower limit in surface insulation r
Electronics Forum | Thu Jul 28 09:47:06 EDT 2005 | fctassembly
Hello Carl, The main reason there is little information on lead free soldering to ENIG is because most of the lead free soldering to date has been Japanese consumer products. To keep costs down, the major surface coating used has been OSP copper. It
Electronics Forum | Tue Aug 23 13:25:10 EDT 2005 | MMurison
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing, e.g. visual, x-ray, C-SAM, el
Electronics Forum | Tue Jul 26 08:20:46 EDT 2005 | Bob R.
All you can do is try it. I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voi
Electronics Forum | Wed Sep 07 16:53:15 EDT 2005 | GS
Contact Cookson Electronic, they can support you with OSP solutions (ENTEK---) new formulations for Lead Free apllication. Regards GS --------- from a 2003 Cookson presentation: Objective Although Existing ENTEK� PLUS CU106A technology is suc
Electronics Forum | Tue Oct 25 12:50:14 EDT 2005 | patrickbruneel
Hi GS Let me tell you first and for all your English is perfectly ok (better then mine). Europe might be unified (on paper as a nation) but I bet it must be difficult to communicate when you have 25 different languages. Maybe this explains why the
