Electronics Forum | Wed Jul 21 20:52:52 EDT 1999 | Scott
| | I have pcb's in which i am experiencing warping. | | the boards are 12.8125" on a diagonal measurement. | | they are out approximatley .010". | | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what i
Electronics Forum | Thu Jul 22 06:54:45 EDT 1999 | Earl Moon
| | | I have pcb's in which i am experiencing warping. | | | the boards are 12.8125" on a diagonal measurement. | | | they are out approximatley .010". | | | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,an
Electronics Forum | Thu Jul 15 17:53:34 EDT 1999 | Boca
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Thu Jul 15 10:33:59 EDT 1999 | Michael Zadrejko
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Wed Jul 07 00:28:59 EDT 1999 | Scott Cook
| Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. John, It depends......mainly on the via size. Tenting works on smaller vias. Tent
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
Electronics Forum | Tue Jul 06 17:03:46 EDT 1999 | Earl Moon
| Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area. Th
Electronics Forum | Tue Jul 06 10:12:44 EDT 1999 | John Thorup
| | Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | | | John, | | No clean is as good as your process, and the paste you are using. Everything I do is no cle
Electronics Forum | Thu Jun 17 20:57:44 EDT 1999 | Earl Moon
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Thu Jun 10 12:05:22 EDT 1999 | Deon Nungaray
| | Hello all! | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's th
