Electronics Forum | Thu May 08 11:58:12 EDT 2003 | fmonette
Hi Chrissie, This might be old news to you but I just wanted to make sure that you are aware of all the implications of BGA rework relative to the control of moisture-sensitive components. For example, you need to keep track of the total exposure t
Electronics Forum | Mon Jun 23 17:28:11 EDT 2003 | Garth
You feel Service and Customer Relations is 80% of the product? To me this statement implies that 80% of my total interaction with the machine is with their service and/or customer relation departments. You must enjoy having your machine down. I wa
Electronics Forum | Mon Jul 21 08:34:44 EDT 2003 | Don Bell
Blow holes/ pin holes in solder joints are the result of multiple root causes. Suggested analysis might look like this; 1) What method of solder preservation is used on the bare board. (hasl,enig, osp, etc.) HASL can leave unwanted flux residues,
Electronics Forum | Mon Jul 21 20:42:12 EDT 2003 | iman
Don, thanks for the thoughtful insight, can I run some thinking points for your further assistance? 1) ours is a Au over Ni PCB bareboard. Do you think excessive Au thickness is any way a influence for poor solder formation? I did notice the PCB ba
Electronics Forum | Fri Oct 03 08:58:22 EDT 2003 | SMT Process
Folks, I use both UP1500 and AccuFlex. The basis for this machine was bought from SMTech several years ago as the SMTech 500. They sold off the last few SMTech machines with the MPM name on them (stupid move because they sucked), but then quickly r
Electronics Forum | Sat Dec 13 08:03:46 EST 2003 | Stefan Witte
The only part, which could cause component misplacement on the rotary heads of the Siplace machine is the vacuum valve. I don�t know the official name in the part catalog, but I use to name it plunger. The plunger is moved in and out by a miniature s
Electronics Forum | Tue Jan 13 16:01:06 EST 2004 | russ
I believe that solder paste will need to be applied to this part. I have re-balled these in the past in a low volume situation and here is what I did and there appears to be no adverse effects to the component. Get a stencil (I use 8 mil for .032"
Electronics Forum | Fri Jan 16 15:41:23 EST 2004 | patrickbruneel
David, You just provided enough material to start an endless debate in an unexplored field (acceptable impurities, levels and effect on reliability in high tin content (lead free alloys). High tin content alloys have a high affinity to metals like C
Electronics Forum | Tue Feb 03 06:52:45 EST 2004 | paul_bmc
About 2 years ago our company tried to go with a post reflow AOI inspection. This AOI was suppose to be able to inspect to a level class 3 product. **It is impossible** You cannot inspect for a heel fillet and inspecting for poor wetting is a very
Electronics Forum | Fri Apr 02 00:16:18 EST 2004 | Mike Konrad
There is no shortage of reasons to clean your boards. Soldering or reflowing your boards leaves �stuff� on them. This �stuff� is normally corrosive and conductive (some fluxes / pastes are more corrosive / conductive than others). In either case,
