Electronics Forum: reliability (Page 216 of 241)

Re: sm ic's

Electronics Forum | Mon Jul 26 05:02:33 EDT 1999 | Wolfgang Busko

| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 12:57:10 EDT 1999 | Earl Moon

| | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something),

Re: Posted wave solder paper to library and my 2 cents on intermetallics

Electronics Forum | Mon Jun 21 13:02:59 EDT 1999 | Earl Moon

| | | I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something)

Re: Alternate surface finishes

Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon

| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info

Re: PCB cleaning

Electronics Forum | Sun Jun 13 05:46:21 EDT 1999 | Brian Ellis

Murray "No-clean" fluxes/pastes should not normally give "white residues". Before exploring cleaning, which is costly for small production levels, I suggest you may care to find out why you have these residues. To help you, can you please answer th

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 04:38:05 EDT 1999 | Gyver

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Criterion of PCBA bending degree

Electronics Forum | Mon Jun 14 09:16:58 EDT 1999 | Adam Pratt

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Criterion of PCBA bending degree

Electronics Forum | Mon Jun 14 14:30:42 EDT 1999 | Deon Nungaray

| | | | | Hello all! | | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We d

Re: Process Change

Electronics Forum | Sun Jun 06 02:04:01 EDT 1999 | Steve Gregory

Hi Ryan! First off, who's telling you you need to do things bass-ackwards from what a normal process dictates? The x-ray vendor, or someone within your company? The only reason that I can think of to do something like that is because that decoupling

Re: BGA rework : IR or convection

Electronics Forum | Wed May 19 10:56:52 EDT 1999 | Glenn Robertson

| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | M


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