Electronics Forum | Thu Aug 26 22:44:40 EDT 2004 | Indy
We do perform multiple reflow only for reliability testing. 90% of the time we have not seen any change in the solder joint and no change in electricals. If you do see failure you might want to see the solderability of the surface finish too.. jus
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Thu Oct 21 16:31:23 EDT 2004 | Tony
I have a component manufacturer that is using Sn/Ag/Cu plating on chip caps and resistors. Does anyone have any information on compatability with Sn/Pb paste. Are any changes in profile required? Is the reliability of the solder joint at risk? Tony
Electronics Forum | Thu Oct 28 21:28:44 EDT 2004 | KEN
BTU is a very reputable company. They make superb products that are reliable. Very solid, feature packed software. Heller.....well.... did I mention BTU?
Electronics Forum | Sun Oct 31 06:42:28 EST 2004 | mattkehoe
Can BGA's really be reliably attached without adding any extra paste? Just use the BGA balls and tacky flux? We are interested in the Pro's and Con's. Seems like a lot of different opinions out there.
Electronics Forum | Mon Nov 01 11:29:30 EST 2004 | davef
There is no IPC requirement for reworking BGA with either paste or just flux. While we generally use flux only, general consensus is that both methods work equally well. Adding solder paste, while more difficult, should result in larger package stand
Electronics Forum | Fri Dec 03 12:17:18 EST 2004 | Dreamsniper
Hi, I was told that there is a reliability problem with a 30 to 50 percent champagne voiding on chip components. What is this? first time I've heard this terminology. can you help me? regards,
Electronics Forum | Sun Dec 12 08:39:32 EST 2004 | davef
The reliability of the measurements provided by your instrument is indicated by consistency. This is a process control tool. it does not provide absolute measurements. It does is not tie to the NBS, er whatever they use in the land of the frozen t
Electronics Forum | Thu Jan 13 09:55:42 EST 2005 | WDLau
Hi Dave, Then you think it is ok to use leaded (Sn/Pb) BGA with Lead free solder paste (SAC)and reflow process, As someone told it is not reliable and it should not be allowed to go,
Electronics Forum | Tue Jan 04 13:09:28 EST 2005 | barryg
WE have had one for many years, it has been very reliable, They are not the cadillac of wave machines, but suitable. Parts from novastar are pricy, but again we have not had many problems.