Electronics Forum: reliability (Page 71 of 241)

Re: Reliable counting equipment for SMT components required

Electronics Forum | Thu Jan 06 15:27:50 EST 2000 | Christopher Lampron

Damian, I have used the Schleuniger, Inc. CC-15 components counter. This is a hand crank operated instruments that counts the holes in the carrier tape. It is simple to operate and set up. We have found the accuracy to be upwards of 98% providing th

seeking low cost fix to tce mismatch

Electronics Forum | Mon Dec 27 22:45:58 EST 1999 | Jim

Is there a way to avoid the reliability problems arising from the tce mismatch between ceramic chip smc's and FR4 laminates, without spending an arm and a leg on expensive substrate materials? Are there inexpensive substrates with reasonably compata

Re: seeking low cost fix to tce mismatch

Electronics Forum | Tue Dec 28 20:31:48 EST 1999 | Jim

Justin, I have a customer who is considering changing from TH to SMT, but his preliminary reliability testing yielded solder joint failures, because his product must endure severe temperature swings. He can't change to an expensive substrate, or he'

BGA Qualification

Electronics Forum | Thu Dec 09 05:01:30 EST 1999 | Patrick Wong

I am task to qualifiy a process for BGA with 560 bumbs and is 1.3" width and if possible also to determine if nitrogen is necessary. BUT I do not know that are the test required and what standard should I follow. I know I will have to reflow the BGA

Re: about QP242

Electronics Forum | Thu Nov 18 14:40:18 EST 1999 | John Queen

Hi Charley Having worked on the QP2 for some time now i have my doubts about its versatility,this machine is my opinion a cheaper alternative to the IP3,which is far more accurate and more reliable. I would advise yo

BGA vs. QFP Packaging.

Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik

I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel

Re: BGA vs. QFP Packaging.

Electronics Forum | Tue Nov 09 13:57:08 EST 1999 | Dave F

Gary: Three things to look at in preparing do your lab work: 1 Delco uses boat-loads of array devices, use your contacts there for information. 2 SMTA Journal publishes much relaibility study information. 3 "Solder Joint Reliability of Bga, Csp, Fl

Re: DOUBLE SIDED SMT ASSY

Electronics Forum | Mon Oct 25 16:04:02 EDT 1999 | Dave F

Jerry: You don't have to yell, we can see you fine Are your first side component going to fall off of the board or have their reliability affected during second side processing? If not, go for it!! Lots of people reflow through hole components.

Re: Automated Labeling for SMT Assembly

Electronics Forum | Thu Oct 28 18:35:58 EDT 1999 | Dave L

JohnJ, Contact Amistar Corporation to find out more about the DataPlace 100LP. I've personally seen it, and other competing machines, in action in production environments...unlike the others, it is a FAST, extremely reliable, well-engineered, and fle

Re: Fine pitch with DEK 260

Electronics Forum | Mon Aug 23 10:28:51 EDT 1999 | K

You should have no problems with this. Are you thinking of buying one or do you already have one - either way it would be worth upgrading to DeKAlign 4 K | Does anyone have an older DEK 260? I was wondering if a 1995 model 260 with DeKAlign 2 is


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