Electronics Forum | Mon May 31 04:06:16 EDT 2004 | johnwnz
You know you'd think that wouldn't you but the only tiem I knew the vendor had changed something was when the silver started to fall off the boards!... you can tell I wasn't chuffed Now I have to say I do prefer Dunkin's to Krispy but I can't say I'
Electronics Forum | Thu May 06 05:34:02 EDT 2004 | Grant Petty
Hi, We are looking at a new pick and place machine that can handle higher throughput. What do people think of the smaller Fuji machines. They look like they have some nice features and are fast. I saw someone's note on Panasonic and reliability. W
Electronics Forum | Fri May 07 07:02:52 EDT 2004 | rlackey
Hi Grant, We use the CP series from Fuji - so not quite the same, but the quality of engineering and company philosophy will almost certainly carry over into the XP range. Our machines are totally bombproof reliability wise, and the programming i
Electronics Forum | Tue May 11 20:49:39 EDT 2004 | alwil
Hi Grant, a few things you should also consider are, do you have a local agent for the piece of kit you are about to purchase. Are spares and consumables readily available in your area. Can you and your staff receive inhouse training or have
Electronics Forum | Thu May 20 17:52:28 EDT 2004 | Grant Petty
Hi, Thanks for the info, and because both types of machines look similar, it's hard to tell which one would be best. So this kind of info really helps. What kinds of issues do you see when running each type of machine, and how reliable are they at
Electronics Forum | Fri Oct 15 10:32:01 EDT 2004 | dscott
I have used fuji XP series for about 3-4 years now. We have XP1, XP2 & XP3 in our Prototype Dept. Excellent machines for this purpose. Very easy to program, can edit at the machine, placement, repeatability, reliability is just like any other Fuji
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Fri May 07 12:02:28 EDT 2004 | Dreamsniper
From my understanding paste on BGA pads are applied only to help in holding the component as the PCB is conveyed during the manufacturing process then soldered. But during rework on BGA's do I have to apply Solder Paste or just Flux? What's the diffe
Electronics Forum | Fri May 07 20:08:39 EDT 2004 | Ken
...um also, don't forget that ther are planarity issues associated with BGA devices AND bow-and-twist issues with PCB materials. An example I have one BGA device that has a ball planarity of 7 mils!!! Ant that's the OEM specification! THis will re
Electronics Forum | Wed Jun 02 20:36:48 EDT 2004 | Ken
I personally would not get involved with any technology as old as the Q4C. I worked in a factory that had about 20 of those and was not impressed. It seemed like there was always some problem (electro/mechanical) and their service was not "world cl
