Electronics Forum | Mon Aug 25 16:48:14 EDT 2008 | petep
Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sent out like BGA's for "re-balling"? Like all of you, we build, profile place and solder for reliability, but the time will come when one of these co
Electronics Forum | Tue Sep 16 09:25:49 EDT 2008 | trynders
I had a vendor change thier lead finish from tin/lead to a SAC305. We built up several assemblies before we realized the change. The reflow process is a standard leaded profile peaking at 220 C. What are the reliablity concerns with mixing the tin/l
Electronics Forum | Tue Sep 23 13:00:28 EDT 2008 | mikesewell
I installed an On Site unit for our SS machine. You'll need to size it in terms of flow rate to your equipment (possibly put a reservoir tank in) and decide on what purity level is required. Maintenance was very minimal. Just remember to factor it
Electronics Forum | Fri Sep 26 12:17:43 EDT 2008 | stepheniii
They have the extra benefit of providing oxygen enriched air at the filter site. We have had no problems and have had the filter for a couple years but we did get a second air compressor because of it. Hmm maybe I should go "inspect" it now. I"m f
Electronics Forum | Thu Oct 02 03:11:42 EDT 2008 | gsala
Ask FELDER (gmbh), they can replace the alloy (SN100 +Ge+Ni ...) or even with a special kit (FUJI Patent) or if preferred you can transform the solder in the pot w/out replace it in a reliable way. http://www.felder.de/en_produkte.phtml Regards...
Electronics Forum | Mon Oct 20 15:41:19 EDT 2008 | patrickbruneel
Josh, You can not check the bare boards for black pad unless you remove the gold plating. Like Robin said black pad is nickel oxidation/corrosion and a result from bad electroless nickel plating bath control. The only preventative action you take is
Electronics Forum | Mon Feb 09 15:41:38 EST 2009 | diamondmt
I would be glad to help you out in recommending a couple of coating choices,(at a very competitive price) but I believe you will have the most success with Parylene coating as long term reliability looks to be very important as well as flexiblity. Th
Electronics Forum | Tue Mar 17 16:09:25 EDT 2009 | gregf912
For the IP3 to reliably place BGAs the machine needs the 4800 vision card and type 12 camera. From the problems i see here you must have the 4400 card and a type 8 or 9 camera. It would also seem that a calibration is in order. I have calibrated and
Electronics Forum | Mon Mar 23 20:31:52 EDT 2009 | tet1
I understand installing BGAs and QFNs with water-soluble fluxes can cause serious near and long-term reliability issues as a result of PCB erosion from trapped flux. Is this a valid concern? There is not a tremendous amount of data online support
Electronics Forum | Tue Mar 31 08:11:51 EDT 2009 | davef
Solder ball formation can be a significant problem if the balls get trapped in the smaller spaces between ceramic chip carriers and substrates or possibly between the leads of small pitch leaded ICs. The solder balls also reduce the solder volume ava