Electronics Forum: reliability of reballed bga (Page 1 of 5)

BGA rework and reliability

Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon

Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on

Re: BGA rework and reliability

Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark

| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

specs or guidlines for how many times you can rework a bga site

Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef

First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

Reballing of Plastic BGA

Electronics Forum | Tue Oct 17 18:27:21 EDT 2000 | Philip Reyes

Hello fellows, Can you clear me up regarding the reballing of Plastic BGA? Is it necessary to reball plastic BGA module if you have missing ball defect? What is the alternative process for rework? Do i need to flip the module then apply paste on

Number of times reworking

Electronics Forum | Tue May 27 10:34:30 EDT 2003 | davef

Much of the ability to survive rework or thermal excursions is dependent upon the fabrication materials. The board qualification criteria under the 55110 was designed around 5 thermal heat cycles. Consider reworking a BGA in this context. BGA i

Reliability of BGA

Electronics Forum | Sun Nov 15 23:40:59 EST 1998 | emori

Our design team is trying to change QFP into BGA. Does anyone have experience wavesoldering PCB with 0.5" pitch BGA's on the top side? What kind of problem will occure? Any advice is appreciated.

Re: Reliability of BGA

Electronics Forum | Mon Nov 16 08:50:04 EST 1998 | Larry Johnson

I don't really no much of any problems other then, be sure that the BGA avoids moisture. If the BGA has moisture inside of it when it across the wave. Due to the heat, the moisture will evaporate and cause shorts inside the BGA. Now if someone can

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

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