Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas
We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer
Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef
Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t
Electronics Forum | Thu Jun 16 16:34:59 EDT 2016 | slthomas
Hi Dave, I'll ask them if they consider it on the next spin....can't see any reason it would have any negative effects. Thanks! Steve
Electronics Forum | Fri Jun 16 10:38:33 EDT 2000 | Iain
I have 15 very large backplanes (.156" thick Au plating) that the ground pins of a high density thru-hole connector were not thermal relieved in the artwork. As a result we are unable to solder the 8 pins that connect to the ground plane. We know t
Electronics Forum | Fri Jun 16 11:08:30 EDT 2000 | Travis Slaughter
Did you try preheating the board then hand solder? Those little heat shrink guns work great for this.
Electronics Forum | Fri Jun 16 11:28:53 EDT 2000 | Boca
Solder 'follows' heat. 1. Preheating is a great idea, use a baking oven to get the whole assembly up to temperature, use the preheaters in your wave solder machine (without wave) to preheat the assemblies ... 2. Or use the biggest soldering iron
Electronics Forum | Sat Jun 17 08:57:23 EDT 2000 | Chrys Shea
A few more tricks to try: - Got a hot air rework machine? You can get more controlled heat on the area and lower the risk of damage to the fab. I never got topside fillets un unrelieve ground planes until I went to convection preheat on my waves.
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Wed Mar 03 09:05:28 EST 2004 | davef
Look to IPC-2221, 9.1.3 Thermal Relief In Conductor Planes
Electronics Forum | Thu Aug 18 00:19:09 EDT 2016 | souldierann
Hi there. would it be possible that thermal relief pads for relay bring bad solder?
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