Electronics Forum | Wed Mar 03 09:05:28 EST 2004 | davef
Look to IPC-2221, 9.1.3 Thermal Relief In Conductor Planes
Electronics Forum | Thu Aug 18 00:19:09 EDT 2016 | souldierann
Hi there. would it be possible that thermal relief pads for relay bring bad solder?
Electronics Forum | Fri Sep 09 05:32:11 EDT 2016 | jasltd
Are your solder relief pads connected to anything in terms of ground planes that would increase the thermal load or are they floating copper? I take it your talking about wave solder relief pads?
Electronics Forum | Mon Jun 02 16:33:35 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
Electronics Forum | Mon Jun 02 19:41:41 EDT 2008 | operator
Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of
Electronics Forum | Wed Mar 03 05:07:06 EST 2004 | Javi
Hello, I would like to design the thermal reliefs/pads of my through-hole components. I would appreciate any info, doc or link about how design them (dimensions, slit width, circular or square, etc). Thanks a lot and best regards, Javi
Electronics Forum | Fri Sep 17 09:31:33 EDT 2004 | C Lampron
Hi Chris, It sounds like you may have to go with your idea of a relief cut into the stencil. Are there any components that need to be printed in close proximity? Is this a high volume?I used to work at a flex house and we had a similar situation. We
Electronics Forum | Tue Jun 03 12:49:29 EDT 2008 | operator
If only my company would pay for a membership to IPC......
Electronics Forum | Wed Jun 04 00:13:18 EDT 2008 | operator
Very informative article. Thanks Dave.
Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas
We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer
