Electronics Forum | Fri Dec 14 10:59:23 EST 2001 | Donald C. Burr
We are considering converting from a water wash wave solder porcess of carbon ink touch pad buttons to a no-clean process. Since the carbon ink buttons are exposed to the molten solder, we are concerned about the residue that is left behind from the
Electronics Forum | Fri Apr 26 09:32:22 EDT 2002 | blnorman
We conformally coat over NC solder paste. No problems. We're using a platinum catalyzed addition cure silicone. The only concern with this conformal coating is cure inhibition. You must test the coating over the residues to be sure there is no in
Electronics Forum | Tue Jun 04 19:15:15 EDT 2002 | rob_thomas
Por, Why do you clean no-clean flux residue?I didn't use the product you mentioned but I got some help from the folks at Cookson group last year when I did wirebonding after no-clean smt processing.check their website.Check your profile as well.unles
Electronics Forum | Wed Jul 17 03:36:00 EDT 2002 | robbied
Answers are: *Mainly copper and potassium. *it looks like a soft growth. *customer will not accept this, hence the returns. These boards are either reworked or scrapped. *Flux is not an issue. *The cleaning process has been found to be the cause of t
Electronics Forum | Wed Aug 14 10:11:01 EDT 2002 | davef
For relow ovens the general approaches are: * Clean the vent pipe. * Replace [a section of ] the vent pipe. * Clean the flux trap on newer ovens. * Do nothing and wonder where that brown slime that is dripping on the boards is coming from. For wave
Electronics Forum | Thu Sep 05 18:15:15 EDT 2002 | pjc
There are chemistries out there that will solublize some post-solder NC flux residues. I have had success with Zestron material Vigon A200 and Petroferm material Hydrex DX. Go to http://www.zestron.com and http://www.petroferm.com These are chemical
Electronics Forum | Mon Oct 28 08:54:57 EST 2002 | Chris Lampron
Good Morning, I think that the use of No clean at SMT and the use of WS at wave is counter productive. For the most part, you will get better results using WS at SMT. If you use No Clean, and then are forced to run this thought a water wash as a req
Electronics Forum | Wed Jun 25 06:43:06 EDT 2003 | cyber_wolf
We are currently producing a board for a customer that has about 400 gold fingers that get wire bonded after the assy. leaves our facility. We have tried many different approaches to ensure that we are not getting solder on the gold fingers. Nothing
Electronics Forum | Fri Apr 30 16:51:57 EDT 2004 | davef
This issue is not "testability of OSP board". It is "testability of nc flux residue". Kester [or some other flux suppler] can probably recommend a flux residue that is more probeable. We have talked about the problems with probes getting gummed-up
Electronics Forum | Tue Jun 01 06:13:11 EDT 2004 | abraham
We have been populating lot of BGA boards and for all these boards we have been using No clean solderpaste. We are under the impression that aqueous cleaning is not recommended for BGA boards as the residue cannot be cleaned properly. However we are
